Epoxy System Chemicals

epoxy system chemicals

2-Methylimidazole Accelerator

CAS: 693-98-1

2-Methylimidazole Accelerator for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

ATBN Rubber Toughener

CAS: 71486-48-1

ATBN Rubber Toughener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

ATH Filler for Epoxy

CAS: 21645-51-2

ATH Filler for Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Alumina Filler for Epoxy

CAS: 1344-28-1

Alumina Filler for Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Antioxidant for Epoxy

CAS: 6683-19-8

Antioxidant for Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

BDMA Accelerator

CAS: 103-83-3

BDMA Accelerator for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

BGDGE Diluent

CAS: 17557-23-2

BGDGE Diluent for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

BPA Reactive Diluent

CAS: 25068-38-6

BPA Reactive Diluent for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Benzyl Alcohol Reactive Thinner

CAS: 100-51-6

Benzyl Alcohol Reactive Thinner for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Bisphenol A Epoxy Resin (Liquid)

CAS: 25068-38-6

Bisphenol A Epoxy Resin (Liquid) for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Bisphenol A Epoxy Resin (Solid)

CAS: 25068-38-6

Bisphenol A Epoxy Resin (Solid) for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Bisphenol F Epoxy Resin (DGEBF)

CAS: 28064-14-4

Bisphenol F Epoxy Resin (DGEBF) is the diglycidyl ether of bisphenol F, structurally analogous to BPA epoxy but with a methylene bridge replacing the isopropylidene group, yielding substantially lower viscosity (1500–5000 mPa·s at 25°C) and epoxide equivalent weight (EEW) of 155–175 g/eq. This low viscosity enables solvent-free, high-filler formulations for self-leveling floor coatings, vacuum infusion composites, and electrical castings where reactive diluents or solvents would compromise performance. DGEBF is fully compatible with standard amine, anhydride, and cycloaliphatic amine hardeners and delivers cured properties comparable to BPA epoxy.

epoxy system chemicals

Bisphenol S Epoxy Resin

CAS: 80-09-1

Bisphenol S Epoxy Resin for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Boron Trifluoride Latent Epoxy Hardener (BF3-MEA)

CAS: 13319-75-0

Boron Trifluoride Latent Epoxy Hardener (BF3-MEA) is the monoethylamine complex of boron trifluoride, a cationic Lewis acid latent curing agent that is stable as a solid at room temperature with pot life exceeding 6 months, yet rapidly cures epoxy resins at 100–150°C in 30–60 minutes. This combination of long shelf life and fast elevated-temperature cure makes BF3-MEA the preferred hardener for one-component (1K) prepreg systems, epoxy powder coatings, and automotive bonding films where pre-mixed stability is critical. It produces cured epoxy networks with high Tg and excellent chemical resistance.

epoxy system chemicals

Brominated Epoxy Resin

CAS: 26265-08-7

Brominated Epoxy Resin for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

CTBN Rubber-Modified Epoxy Resin (Toughened)

CTBN Rubber-Modified Epoxy Resin is a pre-reacted adduct of standard bisphenol A epoxy resin with CTBN (carboxyl-terminated butadiene-nitrile rubber), producing a single-component toughened epoxy that significantly improves fracture toughness, peel strength, and impact resistance versus unmodified epoxy without requiring a separate rubber addition at point of use. The reactive adduct format ensures the rubber phase is chemically bonded into the cured network, forming a phase-separated microstructure that absorbs crack propagation energy. It is the standard toughening approach in aerospace structural adhesives, automotive body panel bonding, and high-performance composite matrices.

epoxy system chemicals

Core-Shell Rubber Toughener

CAS: 9011-14-7

Core-Shell Rubber Toughener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Cresyl Glycidyl Ether Diluent

CAS: 2210-79-9

Cresyl Glycidyl Ether Diluent for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Cycloaliphatic Amine Hardener

CAS: 1760-24-3

Cycloaliphatic Amine Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Cycloaliphatic Epoxy Resin (3,4-Epoxycyclohexyl Methyl Ester)

CAS: 2386-87-0

Cycloaliphatic Epoxy Resin (3,4-Epoxycyclohexyl Methyl Ester) is a difunctional aliphatic epoxide in which both epoxy groups are embedded in alicyclic rings, producing a resin with outstanding UV and weathering stability because there are no aromatic chromophores to yellow under sunlight. With EEW of 128–138 g/eq and viscosity below 500 mPa·s, it is the preferred resin for cationic UV-curable coatings, LED encapsulants, and outdoor-durable automotive and industrial topcoats where aromatic epoxy yellowing is unacceptable. It is cured by cationic photoinitiators, anhydrides, or acid catalysts rather than conventional amines.

epoxy system chemicals

D-230 Polyamine Hardener

CAS: 9046-10-0

D-230 Polyamine Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

D-400 Polyamine Hardener

CAS: 9046-10-0

D-400 Polyamine Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

DDM Aromatic Amine Hardener

CAS: 101-77-9

DDM Aromatic Amine Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

DDS Aromatic Amine Hardener

CAS: 80-08-0

DDS Aromatic Amine Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

DMP-30 Accelerator

CAS: 90-72-2

DMP-30 Accelerator for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Defoamer for Epoxy

CAS: 9046-10-0

Defoamer for Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Dicyandiamide Hardener

CAS: 461-58-5

Dicyandiamide Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Epoxy Ester Resin

CAS: 68554-70-1

Epoxy Ester Resin for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Flexible Epoxy Resin

CAS: 72162-29-9

Flexible Epoxy Resin for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Fumed Silica for Epoxy

CAS: 112945-52-5

Fumed Silica for Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Glycerol Triglycidyl Ether

CAS: 13236-02-7

Glycerol Triglycidyl Ether for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Glycidyl Amine Epoxy

CAS: 28768-32-3

Glycidyl Amine Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

HHPA Anhydride Hardener

CAS: 85-42-7

HHPA Anhydride Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

IPDA Hardener

CAS: 2855-13-2

IPDA Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

MTHPA Anhydride Hardener

CAS: 11070-44-3

MTHPA Anhydride Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Mannich Base Hardener

CAS: 28984-69-2

Mannich Base Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Neopentyl Glycol Diglycidyl Ether

CAS: 17557-23-2

Neopentyl Glycol Diglycidyl Ether for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Nonylphenol Glycidyl Ether

CAS: 27043-37-4

Nonylphenol Glycidyl Ether for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Novolac Epoxy Resin

CAS: 28064-14-4

Novolac Epoxy Resin for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Phenalkamine Hardener

CAS: 68440-65-3

Phenalkamine Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Phosphate Flame Retardant Epoxy

CAS: 68937-41-7

Phosphate Flame Retardant Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Phthalic Anhydride Hardener

CAS: 85-44-9

Phthalic Anhydride Hardener for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Polyethylene Glycol Diglycidyl Ether (PEGDGE)

CAS: 72207-80-8

Polyethylene Glycol Diglycidyl Ether (PEGDGE) is a difunctional flexible epoxy based on polyethylene glycol (PEG-200 or PEG-400) end-capped with glycidyl ether groups, providing a long flexible PEG spacer between the two reactive epoxide termini with EEW of 170–250 g/eq. Used as a reactive flexibilizer and diluent, it reduces brittleness and increases peel strength in rigid epoxy systems, adds hydrophilicity, and improves cryogenic-temperature performance. It is also used as the crosslinker in biomedical hydrogels and water-swellable sealants where biocompatibility and chain flexibility are required.

epoxy system chemicals

Reactive Phosphorus Flame Retardant for Epoxy (DOPO-Based)

CAS: 35948-25-5

Reactive Phosphorus Flame Retardant for Epoxy (DOPO-Based) is derived from DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) and chemically incorporates phosphorus into the epoxy cured network through reactive P–H or P–OH functionality, eliminating the migration and leaching that plagues additive flame retardants. At 3–5% phosphorus content in the cured system, it achieves LOI greater than 28% and UL94 V-0 rating at 1.6 mm, making it the leading halogen-free FR solution for PCB laminates, electronics encapsulants, and aerospace composite structures. Unlike brominated FR epoxies, DOPO-based systems produce minimal corrosive and toxic combustion gases.

epoxy system chemicals

Resorcinol Diglycidyl Ether

CAS: 101-90-6

Resorcinol Diglycidyl Ether for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Silane Coupling Agent for Epoxy

CAS: 919-30-2

Silane Coupling Agent for Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Sorbitol Polyglycidyl Ether

CAS: 68412-01-1

Sorbitol Polyglycidyl Ether for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

TGDDM Tetraglycidyl Resin

CAS: 28768-32-3

TGDDM Tetraglycidyl Resin for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

TMP Triglycidyl Ether

CAS: 3454-29-3

TMP Triglycidyl Ether for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

UV Stabilizer for Epoxy

CAS: 25973-55-1

UV Stabilizer for Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Waterborne Epoxy Resin Dispersion

CAS: 25068-38-6

Waterborne Epoxy Resin Dispersion for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Wetting Agent for Epoxy

CAS: 68551-13-3

Wetting Agent for Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.

epoxy system chemicals

Yellow Pigment for Epoxy

CAS: 1934-21-0

Yellow Pigment for Epoxy for epoxy resin system formulation, providing controlled cure chemistry, mechanical performance, and chemical resistance.