Hexagonal Boron Nitride Thermal Ceramic Additive
CAS Number: 10043-11-5
Hexagonal boron nitride (hBN) is a layered ceramic material with unique properties combining high thermal conductivity (300–600 W/m·K in-plane), electrical insulation, chemical inertness, and excellent lubrication. Used as a thermal management filler in ceramic composites, a sintering additive in Si3N4 ceramics, and a release coating for high-temperature ceramic molds.
Technical Specifications
| appearance | White fluffy powder |
| purity (%) | ≥99 |
| BN content (%) | ≥99 |
| oxygen content (%) | ≤0.5 |
| D50 particle size (µm) | 0.5–15 (various grades) |
Applications
- Thermal filler in ceramic matrix composites for thermal management
- Sintering additive in Si3N4 and SiAlON ceramics
- High-temperature mold release coating for ceramic pressing
- Solid lubricant additive in cutting ceramic tool compositions
- Machinable ceramic component for electronics packaging
Key Features
- Outstanding thermal conductivity combined with electrical insulation
- Excellent lubricity reduces friction in ceramic processing
- Chemically inert in most molten metals and aggressive environments
- Platelet morphology enables alignment for directional thermal conductivity
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CAS Number
10043-11-5
Category
Ceramic / Glass AdditivesAvailability
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