Chemzip

Boron Nitride Filler

CAS Number: 10043-11-5

Boron Nitride Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.

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Technical Specifications

viscosityPaste/solid
operating temp-50 to 200°C
dielectric strength>15 kV/mm
thermal conductivity1–10 W/m·K

Applications

  • Power electronics cooling
  • LED heat dissipation
  • CPU/GPU thermal management
  • Battery thermal management
  • EV power module

Key Features

  • High thermal conductivity for Boron Nitride Filler
  • Electrically insulating
  • Low contact resistance
  • Long-term stability

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Boron Nitride Filler chemical structure

CAS Number

10043-11-5

Availability

In Stock

Sample

Dispatched within 5 days

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