Epoxy Resin E51 (Bisphenol A, EEW 185-210)
CAS Number: 25068-38-6
Epoxy Resin E51 is a higher-purity, lower-viscosity bisphenol A epoxy resin with an epoxide equivalent weight of 185–210 g/eq, offering faster curing and improved processability compared to E44. It is a versatile base resin for solvent-free coatings, high-performance adhesives, and electrical laminates where low viscosity aids wetting and penetration. The resin delivers outstanding mechanical strength, dimensional stability, and resistance to moisture after cure.
Technical Specifications
| color | ≤1 (Gardner) |
| viscosity | 6,000–10,000 mPa·s (25 °C) |
| appearance | Pale yellow transparent liquid |
| hydrolyzableChlorine | ≤0.15% |
| epoxyEquivalentWeight | 185–210 g/eq |
Applications
- Solvent-free floor coatings and self-leveling systems
- High-performance structural adhesives
- Electrical laminates (FR-4) and PCB manufacturing
- Filament-wound pipes and pressure vessels
- Epoxy grouts and anchoring systems
Key Features
- Lower viscosity than E44 for easier processing
- Higher epoxy functionality enabling faster cure
- Excellent wetting of glass fibers and mineral fillers
- High Tg after cure for structural applications
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CAS Number
25068-38-6
Category
Adhesive / Sealant AdditivesAvailability
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