Dicyandiamide (DICY) Latent Curing Agent
CAS Number: 461-58-5
Featured inIndustrial Catalysts
Dicyandiamide (DICY) is the most widely used latent curing agent for epoxy resins, providing exceptional one-component stability at room temperature (>6 months) while curing rapidly at elevated temperatures (150–180 °C). Its fine particle size enables uniform dispersion in epoxy resin systems, giving one-part adhesive films, prepregs, and structural adhesives excellent shelf life and reproducible cure. DICY is the backbone of automotive structural adhesive films and aerospace prepreg systems.
Technical Specifications
| purity | ≥99% |
| moisture | ≤0.1% |
| appearance | White crystalline powder |
| meltingPoint | 207–212 °C |
| averageParticleSize | 3–15 µm (grade dependent) |
Applications
- One-component epoxy adhesive films
- Structural adhesive for automotive body-in-white
- Aerospace CFRP prepregs
- Powder coatings hardener
- Encapsulants for electronics
Key Features
- Exceptional latency—>6 months stability at 25 °C
- Fast cure at 150–180 °C
- Fine grades for homogeneous dispersion
- Industry standard for 1K epoxy adhesives and prepregs
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CAS Number
461-58-5
Category
Adhesive / Sealant AdditivesAvailability
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