Bisphenol F Epoxy Resin (DGEBF)
CAS Number: 28064-14-4
Bisphenol F Epoxy Resin (DGEBF) is the diglycidyl ether of bisphenol F, structurally analogous to BPA epoxy but with a methylene bridge replacing the isopropylidene group, yielding substantially lower viscosity (1500–5000 mPa·s at 25°C) and epoxide equivalent weight (EEW) of 155–175 g/eq. This low viscosity enables solvent-free, high-filler formulations for self-leveling floor coatings, vacuum infusion composites, and electrical castings where reactive diluents or solvents would compromise performance. DGEBF is fully compatible with standard amine, anhydride, and cycloaliphatic amine hardeners and delivers cured properties comparable to BPA epoxy.
Technical Specifications
| EEW | 155–175 g/eq |
| color | ≤100 Hazen (APHA) |
| purity | ≥95% |
| viscosity | 1500–5000 mPa·s at 25 °C |
| appearance | Clear to slightly yellow liquid |
Applications
- Solvent-free self-leveling epoxy floor coatings
- Vacuum infusion and resin transfer molding (RTM) composites
- High-filler electrical casting and potting compounds
- Chemical-resistant coatings for containment areas
- Grout and repair mortars requiring high fluidity
Key Features
- Bisphenol F Epoxy Resin (DGEBF) offers 3–5× lower viscosity than standard BPA epoxy, enabling solvent-free, high-filler formulations
- Lower EEW (155–175) reduces equivalent weight of hardener required, improving crosslink density
- Compatible with all standard epoxy hardener chemistries including amines, anhydrides, and imidazoles
- Fully mixable with BPA epoxy resins to precisely tune viscosity and performance
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CAS Number
28064-14-4
Category
Epoxy System ChemicalsAvailability
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