Copper Sulfate Acid Copper Plating Additive
CAS Number: 7758-98-7
Copper sulfate acid copper plating additive is used in high-speed acid copper sulfate baths to produce bright, highly leveled copper deposits with exceptional throwing power for PCB via-filling and decorative copper plating applications. The additive system contains brightener, carrier, and leveler components that work synergistically to produce mirror-bright copper with uniform thickness distribution across complex geometries. Acid copper plating is the standard for PCB through-hole and via metallization, decorative undercoating, and engineering copper deposits.
Technical Specifications
| pH | 0.0-1.0 (bath pH) |
| appearance | Blue crystalline solid (CuSO4·5H2O) or solution |
| active content (%) | ≥98 |
| use concentration (g/L) | 60-220 |
| copper content in bath (g/L) | 15-55 |
Applications
- PCB through-hole and blind via copper metallization
- Decorative bright copper undercoating on steel and zinc die cast
- Copper bus bar and electrical conductor plating
- Electroforming of copper components and screens
- Copper strike plating under nickel or chrome
Key Features
- Excellent via-filling and through-hole throwing power for PCB
- Mirror-bright leveled deposits with controlled grain structure
- Suitable for both rack and barrel plating applications
- Low organic contamination accumulation for extended bath life
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CAS Number
7758-98-7
Category
Metal Surface TreatmentAvailability
In StockSample
Dispatched within 5 days