Polyimide (PI) High-Temperature Anode Binder
CAS Number: 25036-53-7
Polyimide binder provides exceptional thermal stability (>300°C), outstanding mechanical strength, and excellent electrochemical stability for silicon, SiOx, and high-loading graphite anodes. It is processed from polyamic acid precursor in NMP solution and thermally imidized to form a robust, chemically resistant network that withstands repeated silicon expansion.
Technical Specifications
| appearance | Brown viscous solution (polyamic acid in NMP) |
| moisture (ppm) | ≤500 |
| solid content (%) | 15–25 |
| viscosity (mPa·s, 25°C) | 5000–50000 |
| imidization temperature (°C) | 250–350 |
Applications
- High-silicon anode binder for high-energy-density cells
- SiOx/graphite composite thick electrode binder
- High-temperature battery application anode binder
- Dry-electrode process binder (PI fiber/film form)
- Solid-state battery electrode binder
Key Features
- Thermal stability >300°C enables high-temperature electrode processing and battery operation
- Rigid-flexible PI backbone provides high tensile strength and elasticity for Si volume changes
- Excellent chemical resistance to carbonate electrolytes, HF, and LiPF6 decomposition products
- Customizable molecular weight and imide content for tunable mechanical properties
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