Thermal Underfill Epoxy
CAS Number: 25085-99-8
Thermal Underfill Epoxy provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
Technical Specifications
| viscosity | Paste/solid |
| operating temp | -50 to 200°C |
| dielectric strength | >15 kV/mm |
| thermal conductivity | 1–10 W/m·K |
Applications
- Power electronics cooling
- LED heat dissipation
- CPU/GPU thermal management
- Battery thermal management
- EV power module
Key Features
- High thermal conductivity for Thermal Underfill Epoxy
- Electrically insulating
- Low contact resistance
- Long-term stability
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CAS Number
25085-99-8
Category
Thermal Interface MaterialsAvailability
In StockSample
Dispatched within 5 days