Adhesive / Sealant Additives
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adhesive sealant additives
Acrylic Pressure Sensitive Adhesive
CAS: 9003-01-4
Acrylic Pressure Sensitive Adhesive is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Anaerobic Adhesive Monomer
CAS: 868-77-9
Anaerobic Adhesive Monomer is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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BDMA (Benzyldimethylamine) Epoxy Accelerator
CAS: 103-83-3
Benzyldimethylamine (BDMA) is a tertiary amine accelerator used to speed up the cure of epoxy resin systems cured with anhydrides, polyamides, or other amine hardeners. Even at low loadings (0.5–2 phr), BDMA dramatically reduces cure time and temperature, enabling faster production cycles. It is particularly effective in anhydride-cured epoxy systems for electrical laminates, potting compounds, and transformer coatings.
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Bisphenol F Epoxy Resin (DGEBF)
CAS: 28064-14-4
Bisphenol F Epoxy Resin (DGEBF) is a diglycidyl ether of bisphenol F with significantly lower viscosity than bisphenol A analogues, making it ideal for solvent-free, high-solids formulations. Its lower viscosity enables superior filler loading and improved wetting in adhesives, coatings, and composites. Cured DGEBF systems exhibit improved chemical resistance to solvents and acids compared to BPA-based resins.
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Butyl Glycidyl Ether (BGE) Reactive Diluent
CAS: 2426-08-6
Butyl Glycidyl Ether (BGE) is a monofunctional reactive diluent for epoxy resins that reduces viscosity while participating in the crosslinking reaction upon cure, thus avoiding the plasticizing effect of non-reactive diluents. It is widely used to reduce the viscosity of high-MW epoxy resins for solvent-free coatings, adhesives, and composites without significantly compromising mechanical or chemical resistance. BGE exhibits moderate reactivity and is miscible with most epoxy resins and curing agents.
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C12–C14 Alkyl Glycidyl Ether Reactive Diluent
CAS: 68609-97-2
C12–C14 Alkyl Glycidyl Ether is a monofunctional reactive diluent derived from natural C12–C14 fatty alcohols, offering very low skin sensitization potential compared to short-chain glycidyl ethers while still effectively reducing epoxy resin viscosity. It participates in the cure reaction to build a flexible, resilient network, improving the impact resistance and peel strength of cured adhesives. Its bio-based origin and improved toxicological profile make it a preferred choice for safety-conscious formulators.
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C5 Aliphatic Hydrocarbon Tackifier Resin
CAS: 68131-77-1
C5 Aliphatic Hydrocarbon Resin is a thermoplastic tackifier polymerized from C5 piperylene and isoprene fractions obtained from steam cracking of naphtha. It provides excellent compatibility with natural rubber, SIS, and SBS block copolymers, significantly boosting tack and peel adhesion in hot-melt and solvent-based PSA formulations. Its light color, good thermal stability, and low odor make it preferred for labeling, packaging, and hygiene product adhesives.
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C9 Aromatic Hydrocarbon Tackifier Resin
CAS: 64742-16-1
C9 Aromatic Hydrocarbon Resin is a thermoplastic tackifier produced by cationic polymerization of vinyl aromatic monomers (styrene, vinyltoluene, indene) from the C9 fraction of naphtha cracking. It imparts high tack, excellent adhesion to polar substrates, and good compatibility with SBS, SBR, and neoprene rubbers. C9 resins are widely used in solvent-based adhesives, printing inks, and rubber compounding where higher aromatic content and amber color are acceptable.
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CTBN (Carboxy-Terminated Butadiene-Acrylonitrile) Liquid Rubber
CAS: 68891-46-3
CTBN Liquid Rubber is a carboxy-terminated butadiene-acrylonitrile copolymer used as a reactive toughening agent for epoxy adhesives and structural composites. When reacted with epoxy resins, CTBN phase-separates to form rubber domains that arrest crack propagation, leading to dramatic improvements in fracture toughness (KIc), peel strength, and impact resistance with minimal sacrifice of stiffness or heat resistance. It is widely employed in aerospace structural adhesives, automotive body adhesives, and electronic underfills.
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Calcium Carbonate Filler for Adhesives (Coated GCC/PCC)
CAS: 471-34-1
Coated Calcium Carbonate (GCC/PCC) is the most widely used extender filler in adhesive and sealant formulations, providing volume extension, viscosity adjustment, and improved dimensional stability at low cost. Surface coating with stearic acid or other fatty acids improves compatibility with polymer matrices and reduces moisture uptake. In silicone, polyurethane, and MS polymer sealants, fine-particle coated CaCO3 contributes to smooth extrusion, good surface finish, and balanced mechanical properties.
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Calcium Oxide (Quicklime) Moisture Scavenger
CAS: 1305-78-8
Calcium Oxide (CaO, quicklime) is a high-capacity inorganic moisture scavenger used in moisture-sensitive adhesive, sealant, and encapsulant formulations to extend shelf life and prevent premature cure. It reacts irreversibly with water to form calcium hydroxide, making it highly effective even at very low moisture levels. Fine-grade CaO is used in organic electronics encapsulants (OLED), one-component epoxy films, and polyurethane formulations where residual moisture must be minimized.
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Cationic UV-Curing Epoxy Oligomer
CAS: 25068-38-6
Cationic UV-Curing Epoxy Oligomer is an epoxy-functional resin designed for cationic photopolymerization initiated by diaryliodonium or triarylsulfonium salts. Unlike acrylate UV systems, cationic epoxy cure continues after UV exposure (dark cure), resulting in very low shrinkage, excellent adhesion to metals and glass, and outstanding chemical resistance. These systems are used in high-performance optical, electronic, and industrial UV adhesive applications requiring dimensional precision and chemical durability.
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Contact Adhesive Neoprene
CAS: 9010-98-4
Contact Adhesive Neoprene is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Cyanoacrylate Instant Adhesive
CAS: 7085-85-0
Cyanoacrylate Instant Adhesive is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Cycloaliphatic Epoxy Resin (3,4-Epoxycyclohexylmethyl-3,4-epoxycyclohexane Carboxylate)
CAS: 2386-87-0
Cycloaliphatic Epoxy Resin is a low-viscosity, aromatic-free difunctional epoxy offering exceptional UV stability and outdoor durability. Unlike aromatic epoxies, it resists yellowing and chalking under UV exposure, making it suitable for outdoor coatings, optical adhesives, and UV-curable systems. Cured systems exhibit high Tg, excellent electrical insulation, and very low moisture absorption.
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DMP-30 (2,4,6-Tris(dimethylaminomethyl)phenol) Epoxy Accelerator
CAS: 90-72-2
DMP-30 is a trifunctional tertiary amine and phenol accelerator widely used to catalyze epoxy curing with amines, polyamides, and anhydrides. It accelerates pot life reduction and reduces cure temperature, enabling room-temperature cure of systems that would otherwise require elevated temperatures. DMP-30 is also used as a standalone curing agent at higher loadings for rapid-cure adhesive and casting applications.
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DOP (Dioctyl Phthalate) Plasticizer for Adhesives
CAS: 117-81-7
Dioctyl Phthalate (DOP, also known as DEHP) is a general-purpose plasticizer used in adhesive and sealant formulations to impart flexibility, reduce glass transition temperature, and improve low-temperature performance. It is compatible with PVC, nitrile rubber, polysulfide, and polyurethane sealants, making it versatile across multiple adhesive technologies. In sealant formulations, DOP reduces hardness and extends service life in dynamic joint applications.
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Dibutyltin Bis(2-ethylhexanoate) (DBTEH) Catalyst
CAS: 2781-10-4
Dibutyltin Bis(2-ethylhexanoate) (DBTEH) is an organotin catalyst with lower toxicity and improved hydrolytic stability compared to DBTDL, used to accelerate cure in polyurethane and silicone adhesive and sealant systems. Its reduced tendency to hydrolyze makes it more suitable for moisture-sensitive formulations that require extended storage stability. DBTEH provides excellent catalytic activity for NCO-based reactions and is compatible with both solvent-free and solvent-borne PU systems.
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Dibutyltin Dilaurate (DBTDL) Catalyst
CAS: 77-58-7
Dibutyltin Dilaurate (DBTDL) is an organotin Lewis acid catalyst widely used to accelerate the cure of polyurethane adhesives and sealants, RTV silicone sealants, and moisture-curing silane-modified polymer systems. It catalyzes both the urethane (NCO-OH) and urea (NCO-H2O) reactions, enabling faster room-temperature cure without significantly reducing pot life at normal use levels (0.01–0.1 phr). DBTDL is the industry-standard cure catalyst for one- and two-component PU and silicone systems.
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Dicyandiamide (DICY) Latent Curing Agent
CAS: 461-58-5
Dicyandiamide (DICY) is the most widely used latent curing agent for epoxy resins, providing exceptional one-component stability at room temperature (>6 months) while curing rapidly at elevated temperatures (150–180 °C). Its fine particle size enables uniform dispersion in epoxy resin systems, giving one-part adhesive films, prepregs, and structural adhesives excellent shelf life and reproducible cure. DICY is the backbone of automotive structural adhesive films and aerospace prepreg systems.
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Dimer Acid (Dimerized Fatty Acid) Flexibilizer
CAS: 61788-89-4
Dimer Acid is a C36 dicarboxylic acid produced by dimerization of unsaturated fatty acids (primarily oleic/linoleic acid), widely used as a flexibilizer and modifier in epoxy adhesive systems. When incorporated as part of the curing agent or as a reactive flexibilizer, it introduces long aliphatic chain segments into the epoxy network, dramatically improving peel strength, impact resistance, and low-temperature flexibility. Dimer acid-based polyamide curing agents are a cornerstone of flexible epoxy adhesive technology.
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Dodecanedioic Acid (DDA) Latent Curing Agent
CAS: 693-23-2
Dodecanedioic Acid (DDA) is a solid dicarboxylic acid used as a latent curing agent for epoxy and TGIC-free powder coating systems, offering excellent storage stability and a smooth, flexible cure at 160–200 °C. When used in combination with epoxy resins, DDA produces powder coatings and adhesives with good flow, high gloss, and improved flexibility versus anhydride-cured systems. Its lower reactivity at room temperature gives outstanding one-component stability.
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EDB (Ethyl 4-(dimethylamino)benzoate) Amine Synergist
CAS: 10287-53-3
EDB (Ethyl 4-dimethylaminobenzoate) is a tertiary amine co-initiator and synergist widely used with Type II photoinitiators (benzophenone, thioxanthone) in UV adhesive and coating formulations. It donates a hydrogen atom to excited photoinitiator triplet states, dramatically accelerating surface and bulk cure rate and reducing oxygen inhibition. EDB also improves the yellowing resistance compared to aliphatic amine synergists, making it preferred for clear and light-colored UV adhesive systems.
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Epoxy Acrylate Oligomer (EA) for UV Adhesives
CAS: 55818-57-0
Epoxy Acrylate Oligomer (EA) is produced by reacting bisphenol A epoxy resin with acrylic acid, combining fast UV cure speed with high hardness, excellent chemical resistance, and strong adhesion to glass and metals. It is the most widely used UV-curable oligomer in adhesive applications, offering a high refractive index and low cure shrinkage. EA-based UV adhesives are used extensively in glass bonding, optical assemblies, electronics, and UV-curable printing ink applications.
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Epoxy Novolac Resin (EPN/ECN)
CAS: 28064-14-4
Epoxy Novolac Resin (EPN/ECN) is a multifunctional epoxy resin derived from novolac phenol-formaldehyde condensates, providing high epoxy functionality (f > 2) and superior thermal and chemical resistance after cure. Its dense crosslink network yields adhesives and coatings with outstanding performance at elevated temperatures and in aggressive chemical environments. Novolac epoxies are commonly used in demanding industrial adhesive, electrical laminate, and chemical-resistant coating applications.
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Epoxy Resin E44 (Bisphenol A, EEW 210-240)
CAS: 25068-38-6
Epoxy Resin E44 is a standard-grade bisphenol A diglycidyl ether (BADGE) with an epoxide equivalent weight of 210–240 g/eq and moderate viscosity, widely used in structural adhesives and composite matrices. Its balanced reactivity and adhesion to metals, concrete, and composites make it the industry workhorse for two-component epoxy systems. It cures readily with polyamine, polyamide, or anhydride curing agents to yield strong, chemically resistant bonds.
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Epoxy Resin E51 (Bisphenol A, EEW 185-210)
CAS: 25068-38-6
Epoxy Resin E51 is a higher-purity, lower-viscosity bisphenol A epoxy resin with an epoxide equivalent weight of 185–210 g/eq, offering faster curing and improved processability compared to E44. It is a versatile base resin for solvent-free coatings, high-performance adhesives, and electrical laminates where low viscosity aids wetting and penetration. The resin delivers outstanding mechanical strength, dimensional stability, and resistance to moisture after cure.
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Fumed Silica for Adhesives and Sealants (Hydrophilic)
CAS: 112945-52-5
Hydrophilic fumed silica is a high-purity, nanoscale amorphous silicon dioxide produced by flame hydrolysis, widely used as a thixotropic agent and reinforcing filler in adhesives and sealants. Its very high surface area (150–380 m²/g) and surface hydroxyl groups form a hydrogen-bond network that imparts thixotropy, prevents sag, and reinforces the cured adhesive. It is the primary rheology modifier for epoxy, polyurethane, silicone, and acrylic adhesive and sealant systems.
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Glycerol Ester of Rosin (Ester Gum)
CAS: 8050-31-5
Glycerol Ester of Rosin (Ester Gum) is produced by esterification of rosin with glycerol, yielding a pale-colored resin with improved compatibility, higher softening point, and greater stability than unmodified rosin. It is a premier tackifier for hot-melt adhesives, pressure-sensitive tapes, and chewing gum bases, offering excellent tack, peel strength, and shear resistance. Ester Gum is FDA-compliant for food-contact applications and compatible with SIS, SBS, EVA, and natural rubber.
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HDDA (1,6-Hexanediol Diacrylate) Reactive Thinner
CAS: 13048-33-4
HDDA (1,6-Hexanediol Diacrylate) is a low-viscosity difunctional acrylate reactive diluent that reduces the viscosity of UV-curable adhesive and coating formulations while contributing to crosslink density and flexibility. Its six-carbon spacer between acrylate groups imparts greater flexibility and elongation compared to shorter diol diacrylates, while its bifunctionality ensures incorporation into the crosslinked network without plasticization. HDDA is widely used in UV adhesives, UV coatings, and printing inks.
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Hot Melt Polyamide Adhesive
CAS: 63428-84-2
Hot Melt Polyamide Adhesive is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Hybrid Sealant Polymer (SMP/STPE)
CAS: 67762-19-0
Hybrid Sealant Polymer (SMP/STPE) is a silane-terminated polyurethane or polyether designed to combine the best properties of polyurethane and silicone technologies into a single product. It offers high elongation, excellent adhesion, fast skinning, and outstanding weathering resistance with no isocyanate hazard. Used widely in construction, automotive aftermarket, and industrial maintenance, it delivers durable elastic seals on concrete, metals, and plastics.
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Hydrogenated Rosin
CAS: 65997-06-0
Hydrogenated Rosin is produced by catalytic hydrogenation of gum or wood rosin, resulting in improved color stability, oxidative resistance, and reduced crystallization tendency compared to unmodified rosin. It is an important intermediate for producing high-quality rosin esters used as tackifiers in hot-melt adhesives, pressure-sensitive adhesives, and chewing gum bases. Its improved thermal and oxidative stability makes it suitable for demanding high-temperature adhesive applications.
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Isophorone Diamine (IPDA) Curing Agent
CAS: 2855-13-2
Isophorone Diamine (IPDA) is a cycloaliphatic primary diamine used as a curing agent for epoxy resins, delivering non-yellowing, high-gloss coatings and adhesives with excellent UV stability. Its cycloaliphatic structure imparts higher Tg and better outdoor durability than linear aliphatic amines, while its moderate reactivity allows adequate working time. IPDA-cured epoxies are widely used in decorative floor coatings, clear adhesives, and UV-stable aerospace coatings.
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MS Polymer (Silyl-Modified Polyether)
CAS: 67762-19-0
MS Polymer is a silyl-terminated polyether (silane-modified polyether) that combines the flexibility and adhesion of polyurethanes with the UV stability and paintability of silicones. It cures with atmospheric moisture at room temperature without isocyanates, making it an environmentally friendly choice for elastic bonding and sealing. MS Polymer-based adhesives and sealants offer excellent adhesion to most substrates including plastics, glass, metals, and painted surfaces without primers.
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MS Polymer Sealant Base
CAS: 67674-67-3
MS Polymer Sealant Base is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Mineral Oil Defoamer for Adhesives and Sealants
CAS: 8042-47-5
Mineral oil-based defoamer is a cost-effective antifoam agent used to suppress foam formation and eliminate air entrapment in waterborne and reactive adhesive and sealant manufacturing processes. It is particularly effective in high-shear mixing, dispensing, and application operations where air incorporation can lead to voids, surface defects, and reduced bond strength. The formulation combines hydrophobic mineral oil with hydrophobic silica particles for synergistic foam knockdown and persistent antifoam performance.
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Photoinitiator 819 (Phenylbis(2,4,6-trimethylbenzoyl)phosphine Oxide, BAPO)
CAS: 162881-26-7
Photoinitiator 819 (BAPO) is a bisacylphosphine oxide Type I photoinitiator with exceptionally wide absorption extending to 470 nm, providing outstanding deep cure and through-cure in thick, pigmented, and white UV adhesive and coating systems. Each molecule generates two radical pairs upon UV excitation, resulting in very high efficiency and low required concentration. It is the preferred photoinitiator for white and opaque UV adhesives, dental materials, and light-curable encapsulants.
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Polyamide Wax Rheology Modifier for Adhesives
CAS: 57456-28-7
Polyamide wax rheology modifier is an organogelling agent that imparts thixotropy and sag resistance to solvent-borne, hot-melt, and reactive adhesive systems. It forms a three-dimensional gel network via hydrogen bonding that breaks down under shear for easy application and rebuilds at rest to prevent sag and settling. Polyamide wax is compatible with a wide range of resins including epoxies, polyurethanes, alkyds, and polyesters.
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Polyetheramine D230 Curing Agent
CAS: 9046-10-0
Polyetheramine D230 is a low-molecular-weight (Mn ~230 g/mol), difunctional aliphatic amine curing agent for epoxy resins with a polyoxypropylene backbone that imparts flexibility and toughness to cured systems. It reacts with epoxy groups at room temperature or with mild heating, producing coatings and adhesives with excellent flexibility, impact resistance, and low-temperature performance. D230 is widely used in flooring systems, civil engineering adhesives, and casting resins.
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Polyetheramine D400 Curing Agent
CAS: 9046-10-0
Polyetheramine D400 is a medium-molecular-weight (Mn ~400 g/mol) difunctional aliphatic amine with a longer polyoxypropylene chain than D230, providing higher flexibility, longer working time, and reduced exotherm in epoxy cure reactions. Its low volatility and reduced skin-sensitization potential compared to aromatic amines make it safer for industrial use. D400 is preferred for thick-section adhesives, civil engineering applications, and highly flexible epoxy systems.
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Polyurethane Acrylate Oligomer (PUA) for UV Adhesives
CAS: 72162-39-1
Polyurethane Acrylate Oligomer (PUA) combines the flexibility and toughness of polyurethane chemistry with the fast UV-curable functionality of acrylates, delivering soft, elastic, yet adherent UV-cured adhesives and coatings. PUA-based formulations offer outstanding peel strength, elongation, and impact resistance, making them ideal for flexible electronics, medical device bonding, and pressure-sensitive UV adhesives. A wide range of grades—from soft and elastic to hard and rigid—is available.
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Polyurethane Prepolymer (MDI-Based, NCO-Terminated)
CAS: 9016-87-9
MDI-based NCO-terminated polyurethane prepolymer is a versatile building block for one- and two-component polyurethane adhesives, sealants, and elastomers. It reacts with moisture, polyols, or amines to form tough, flexible bonds with excellent dynamic fatigue resistance. The controlled NCO content and low free MDI content make it suitable for demanding structural and elastic bonding applications in automotive, construction, and footwear industries.
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Polyurethane Sealant Prepolymer
CAS: 9009-54-5
Polyurethane Sealant Prepolymer is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Precipitated Silica for Adhesives and Sealants
CAS: 112926-00-8
Precipitated silica is a synthetic amorphous silicon dioxide produced by wet chemical precipitation, used as a reinforcing filler, thickener, and matting agent in adhesives and sealants. It provides cost-effective viscosity and thixotropy control, improves cohesive strength, and reduces gloss in silicone, polyurethane, and polysulfide sealants. Compared to fumed silica, precipitated grades offer higher pore volume and lower cost, making them suitable for high-fill adhesive and sealant formulations.
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Rosin Tackifier (Gum Rosin, WW/WG Grade)
CAS: 8050-09-7
Gum Rosin is a natural resin obtained by tapping pine trees, consisting primarily of abietic and related resin acids. It is a cost-effective tackifier for hot-melt adhesives, pressure-sensitive adhesives (PSA), and rubber-based adhesive formulations. Rosin and its derivatives increase tack, peel strength, and cohesion in adhesive systems while maintaining good compatibility with natural and synthetic rubbers as well as EVA polymers.
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Rubber to Metal Bonding Agent
CAS: 9006-04-6
Rubber to Metal Bonding Agent is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Silane Adhesion Promoter A-174
CAS: 2530-85-0
Silane Adhesion Promoter A-174 is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Silane Coupling Agent A-1100 (γ-Aminopropyltriethoxysilane, APTES)
CAS: 919-30-2
Silane Coupling Agent A-1100 (KH-550, APTES) is an amino-functional silane widely used to improve adhesion between epoxy, polyurethane, and phenolic resins and inorganic substrates. The primary amine group reacts directly with epoxy resins as a co-curing agent while the triethoxysilyl group bonds to glass, silica, and metal oxide surfaces. A-1100 is a standard treatment for glass fiber sizing, mineral filler surface modification, and metal primer applications.
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Silane Coupling Agent A-174 (γ-Methacryloxypropyltrimethoxysilane, MPS)
CAS: 2530-85-0
Silane Coupling Agent A-174 (KH-570, MPS) is a methacrylate-functional silane used to improve adhesion between UV-curable, acrylic, and unsaturated polyester resins and inorganic substrates. The methacrylate group copolymerizes with acrylic monomers during UV or peroxide cure while the trimethoxysilyl group bonds to glass, silica fillers, and metal surfaces. It is widely used in UV adhesives, acrylic sealants, dental composites, and glass fiber-reinforced polymer composites.
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Silane Coupling Agent A-187 (γ-Glycidoxypropyltrimethoxysilane)
CAS: 2530-83-8
Silane Coupling Agent A-187 (KH-560, GPTMS) is an epoxy-functional silane that acts as a molecular bridge between organic adhesive/coating matrices and inorganic substrates such as glass, metals, and minerals. It significantly improves adhesion, wet durability, and hydrolytic stability in epoxy adhesives, sealants, and composite systems by forming covalent bonds with both the resin and the substrate. A-187 is a standard adhesion promoter in epoxy, polyurethane, and acrylic adhesive formulations.
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Silicone RTV Sealant Base
CAS: 63148-62-9
Silicone RTV Sealant Base is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Silicone Sealant Base Polymer (α,ω-Dihydroxy Polydimethylsiloxane)
CAS: 70131-67-8
α,ω-Dihydroxy polydimethylsiloxane (PDMS) is the primary base polymer for room-temperature-vulcanizing (RTV) silicone sealants, offering a unique combination of flexibility, thermal stability (−60 °C to +200 °C), and UV resistance. It crosslinks with silane crosslinkers in the presence of moisture and tin or titanium catalysts to give durable, elastic seals. The polymer backbone is chemically inert, water-repellent, and resistant to ozone and UV degradation.
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Silicone-Free Wetting Agent for Adhesives
CAS: 28519-02-0
Silicone-free wetting agent based on modified polyether siloxane-free chemistry is used in waterborne and solvent-borne adhesive formulations to improve substrate wetting, reduce surface tension, and enhance adhesion to low-energy substrates. It lowers the dynamic contact angle on plastics, metals, and treated papers, enabling uniform adhesive spreading and eliminating crawling or fisheye defects. Silicone-free grades are preferred in systems where silicone contamination is undesirable, such as automotive painting lines.
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TPGDA (Tripropylene Glycol Diacrylate) Reactive Thinner
CAS: 42978-66-5
TPGDA (Tripropylene Glycol Diacrylate) is a difunctional acrylate reactive thinner with low skin sensitization, fast UV cure response, and low odor, making it one of the most widely used reactive diluents in UV adhesive and coating applications. Its ether-containing backbone imparts flexibility and good adhesion to plastic substrates. TPGDA is favored in UV inkjet, flexographic printing inks, UV adhesives, and flexible coating formulations requiring low migration and reduced sensitization risk.
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TPO (Diphenyl(2,4,6-trimethylbenzoyl)phosphine Oxide) Photoinitiator
CAS: 75980-60-8
TPO is a highly efficient Type I radical photoinitiator with strong absorption in the near-UV and visible range (up to 420 nm), enabling effective cure through pigmented, thick, or filled adhesive formulations. Its longer wavelength absorption compared to benzophenone-type initiators gives better through-cure in pigmented and white adhesive systems. TPO is widely used in UV adhesives, dental composites, UV inks, and coatings where good depth of cure is critical.
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Terpene Resin Tackifier (β-Pinene Based)
CAS: 9003-74-1
Terpene Resin is a naturally derived tackifier polymerized from β-pinene monomers sourced from turpentine oil, offering excellent compatibility with natural rubber, EVA, and APAO polymers. It provides outstanding tack, good heat resistance, and a pleasant natural odor profile, making it well-suited for food-contact packaging adhesives and hygiene products. Its renewable origin and light color make it an attractive sustainable alternative to petroleum-based tackifiers.
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Titanate Coupling Agent for Adhesives (Isopropyl Titanate)
CAS: 546-68-9
Titanate coupling agents are organotitanium compounds used to improve interfacial adhesion between inorganic fillers and organic polymer matrices in adhesive formulations. They reduce filler viscosity, improve wetting of mineral fillers, and enhance the mechanical and thermal performance of the cured adhesive. Titanate coupling agents are particularly effective with calcium carbonate, alumina trihydrate, and other metal oxide fillers in polyolefin-based and filled adhesive systems.
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Vinyltriethoxysilane (VTES) Moisture Scavenger
CAS: 78-08-0
Vinyltriethoxysilane (VTES) is a reactive silane used as a moisture scavenger in moisture-sensitive adhesive and sealant formulations, particularly one-component polyurethane and silane-modified polymer (SMP/MS) systems. It reacts rapidly and preferentially with trace water, protecting the reactive NCO or silyl groups from premature cure during storage. VTES also acts as a crosslinker and adhesion promoter in silicone and polyolefin systems.
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m-Xylylenediamine (MXDA) Curing Agent
CAS: 1477-55-0
m-Xylylenediamine (MXDA) is a primary aliphatic/araliphatic diamine curing agent for epoxy resins, offering faster room-temperature cure and higher chemical resistance than purely aliphatic amines. Its benzylic amine structure provides high reactivity, allowing thin-film cure at low temperatures and excellent adhesion to steel and concrete. MXDA is widely employed in corrosion-protective epoxy coatings, marine adhesives, and low-temperature-cure civil engineering grouts.
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