Thermal Interface Materials
Explore our Thermal Interface Materials chemical additives sourced from qualified Chinese manufacturers — competitive pricing, reliable quality. 48 products available.
thermal interface materials
Acrylic Thermal Adhesive
CAS: 9003-01-4
Acrylic Thermal Adhesive provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Alumina Ceramic Substrate
CAS: 1344-28-1
Alumina Ceramic Substrate provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Aluminum Nitride Powder
CAS: 24304-00-5
Aluminum Nitride Powder provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Barium Titanate Thermal Filler
CAS: 12047-27-7
Barium Titanate Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Beryllium Oxide Ceramic Filler
CAS: 1304-56-9
Beryllium Oxide Ceramic Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Boron Nitride Filler
CAS: 10043-11-5
Boron Nitride Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Carbon Black Thermal Additive
CAS: 1333-86-4
Carbon Black Thermal Additive provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Carbon Fiber Thermal Composite
CAS: 7440-44-0
Carbon Fiber Thermal Composite provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Carbon Nanotube Thermal Composite
CAS: 308068-56-6
Carbon Nanotube Thermal Composite provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Ceramic Filled Thermal Epoxy
CAS: 25085-99-8
Ceramic Filled Thermal Epoxy provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Coated Alumina Thermal Filler
CAS: 1344-28-1
Coated Alumina Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Copper Filled Thermal Paste
CAS: 7440-50-8
Copper Filled Thermal Paste provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Diamond Thermal Powder
CAS: 7782-40-3
Diamond Thermal Powder provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Expandable Graphite Thermal
CAS: 7440-44-0
Expandable Graphite Thermal provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Graphene Thermal Filler
CAS: 7782-42-5
Graphene Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Hexagonal BN Platelet
CAS: 10043-11-5
Hexagonal BN Platelet provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Indium Thermal Pad
CAS: 7440-74-6
Indium Thermal Pad provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Low Bleed Thermal Grease
CAS: 63148-62-9
Low Bleed Thermal Grease provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Low Melt Alloy Thermal Interface
CAS: 7439-93-2
Low Melt Alloy Thermal Interface provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Magnesia Thermal Filler
CAS: 1309-48-4
Magnesia Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Metal Oxide Blend Filler
CAS: 1309-48-4
Metal Oxide Blend Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Mica Thermal Insulation
CAS: 12001-26-2
Mica Thermal Insulation provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Molybdenum Disulfide Thermal
CAS: 1317-33-5
Molybdenum Disulfide Thermal provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Nano Alumina Thermal
CAS: 1344-28-1
Nano Alumina Thermal provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Nano Silver Thermal Ink
CAS: 7440-22-4
Nano Silver Thermal Ink provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Phase Change Thermal Pad
CAS: 8002-74-2
Phase Change Thermal Pad provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Polyphenylene Sulfide Thermal
CAS: 25212-74-2
Polyphenylene Sulfide Thermal provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Silicon Carbide Thermal Filler
CAS: 409-21-2
Silicon Carbide Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Silicone Phase Change Material
CAS: 63148-62-9
Silicone Phase Change Material provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Silicone-Free Thermal Grease
CAS: 9004-99-3
Silicone-Free Thermal Grease provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Silver Thermal Paste
CAS: 7440-22-4
Silver Thermal Paste provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Solder Thermal Interface
CAS: 7440-31-5
Solder Thermal Interface provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Adhesive Epoxy
CAS: 25085-99-8
Thermal Adhesive Epoxy provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Conductive Adhesive Film
CAS: 25035-69-2
Thermal Conductive Adhesive Film provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Coupling Agent Silane
CAS: 78-08-0
Thermal Coupling Agent Silane provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Epoxy Silver Filled
CAS: 7440-22-4
Thermal Epoxy Silver Filled provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Gel Encapsulant
CAS: 63148-62-9
Thermal Gel Encapsulant provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Grease Compound
CAS: 63148-62-9
Thermal Grease Compound provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Interface Film
CAS: 9002-88-4
Thermal Interface Film provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal PCM Encapsulated
CAS: 57-11-4
Thermal PCM Encapsulated provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Potting Compound
CAS: 9016-87-9
Thermal Potting Compound provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Silicone Encapsulant
CAS: 63148-62-9
Thermal Silicone Encapsulant provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Tape Acrylic
CAS: 25085-02-3
Thermal Tape Acrylic provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Underfill Epoxy
CAS: 25085-99-8
Thermal Underfill Epoxy provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Thermal Via Fill Paste
CAS: 7440-50-8
Thermal Via Fill Paste provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Titanium Dioxide Thermal
CAS: 13463-67-7
Titanium Dioxide Thermal provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Zinc Oxide Thermal Additive
CAS: 1314-13-2
Zinc Oxide Thermal Additive provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Zinc Sulfide Thermal Filler
CAS: 1314-98-3
Zinc Sulfide Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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