Electroless Copper PCB Formaldehyde Reducer
CAS Number: 50-00-0
Formaldehyde-based electroless copper reducer is the classical reducing agent for electroless copper deposition on printed circuit boards, providing reliable, adherent copper metallization of through-holes and blind vias in PCB fabrication. Formaldehyde reduces cupric ions to metallic copper on catalyzed (palladium-activated) surfaces through an autocatalytic reaction at alkaline pH. The process delivers conformal, void-free copper deposits essential for reliable PCB electrical interconnection before electrolytic copper thickening.
Technical Specifications
| pH | >12.0 (bath pH) |
| appearance | Clear colourless to pale yellow liquid |
| purity (%) | ≥37 (37% aqueous solution) |
| active content (%) | ≥37 |
| deposition rate (μm/h) | 1-3 |
Applications
- PCB through-hole and blind via electroless copper metallization
- Multilayer PCB inner layer copper interconnection
- Flexible circuit board copper metallization
- IC substrate and advanced packaging copper deposition
- Electroless copper on plastics for EMI shielding
Key Features
- Industry-standard reducing agent for PCB electroless copper
- Produces void-free, adherent copper deposits in high-aspect-ratio holes
- Autocatalytic reaction requires no external power supply
- Formaldehyde-free alternatives available for safer processing