Hollow Glass Microspheres — Fine Grade for Coatings & Composites
Número CAS: 65997-17-3
Ultra-fine hollow borosilicate glass microspheres with d50 20–40 µm and d90 ≤ 70 µm, specifically engineered for thin-film coatings, 3D printing resins, and high-frequency electronic composites where standard grades (d50 45–80 µm) are too coarse. True density 0.20–0.42 g/cm³, isostatic crush strength 750–2,000 psi, thermal conductivity 0.048–0.056 W/m·K, dielectric constant 1.2–1.8 at 1 MHz. Delivers excellent surface finish in spray coatings, sub-1 mm thin-film insulation, and precision SMC/BMC parts.
Especificaciones Técnicas
| color | White to off-white free-flowing powder |
| composition | Alkali-lime borosilicate glass |
| true density | 0.20 – 0.42 g/cm³ |
| crush strength | 750 – 2,000 psi (5.2 – 13.8 MPa) |
| flotation rate | ≥ 95% |
| softening point | ≥ 600 °C |
| moisture content | ≤ 0.3% |
| particle size d50 | 20 – 40 µm |
| particle size d90 | ≤ 70 µm |
| dielectric constant | 1.2 – 1.8 (at 1 MHz) |
| thermal conductivity | 0.048 – 0.056 W/m·K |
Aplicaciones
- Thermal insulation spray coatings (sub-1 mm DFT)
- 3D printing photopolymer and SLA resin fillers
- 5G radome composites and low-dielectric laminates
- Thin-film anti-condensation coatings
- Precision SMC/BMC lightweight composites
- Aerogel hybrid insulation coatings
- Cosmetic formulations — lightweight texturizer
Características Principales
- Ultra-fine d50 20–40 µm enables smooth spray coatings and sub-1 mm thin films
- Low dielectric constant (1.2–1.8 at 1 MHz) for 5G radome and high-frequency electronics
- Ultra-low density (0.20–0.42 g/cm³) reduces part weight by 20–40%
- High flotation rate (≥95%) ensures uniform dispersion in liquid systems
- Ultra-low dielectric constant (1.1–1.8 at 1 MHz) for 5G and radar applications
- Excellent thermal insulation (λ ≈ 0.048–0.056 W/m·K)
- Chemically inert — resistant to acids, alkalis, and solvents
- Spherical morphology improves flowability and surface finish
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