Adhesive / Sealant Additives
60 products
Adhesive / Sealant Additives
Tackifiers, plasticizers & crosslinkers for structural and general adhesives
60 products
60 products
adhesive sealant additives
Acrylic Pressure Sensitive Adhesive
CAS: 9003-01-4
Acrylic Pressure Sensitive Adhesive is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Anaerobic Adhesive Monomer
CAS: 868-77-9
Anaerobic Adhesive Monomer is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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BDMA (Benzyldimethylamine) Epoxy Accelerator
CAS: 103-83-3
Benzyldimethylamine (BDMA) is a tertiary amine accelerator used to speed up the cure of epoxy resin systems cured with anhydrides, polyamides, or other amine hardeners. Even at low loadings (0.5–2 phr), BDMA dramatically reduces cure time and temperature, enabling faster production cycles. It is particularly effective in anhydride-cured epoxy systems for electrical laminates, potting compounds, and transformer coatings.
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Bisphenol F Epoxy Resin (DGEBF)
CAS: 28064-14-4
Bisphenol F Epoxy Resin (DGEBF) is a diglycidyl ether of bisphenol F with significantly lower viscosity than bisphenol A analogues, making it ideal for solvent-free, high-solids formulations. Its lower viscosity enables superior filler loading and improved wetting in adhesives, coatings, and composites. Cured DGEBF systems exhibit improved chemical resistance to solvents and acids compared to BPA-based resins.
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Butyl Glycidyl Ether (BGE) Reactive Diluent
CAS: 2426-08-6
Butyl Glycidyl Ether (BGE) is a monofunctional reactive diluent for epoxy resins that reduces viscosity while participating in the crosslinking reaction upon cure, thus avoiding the plasticizing effect of non-reactive diluents. It is widely used to reduce the viscosity of high-MW epoxy resins for solvent-free coatings, adhesives, and composites without significantly compromising mechanical or chemical resistance. BGE exhibits moderate reactivity and is miscible with most epoxy resins and curing agents.
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C12–C14 Alkyl Glycidyl Ether Reactive Diluent
CAS: 68609-97-2
C12–C14 Alkyl Glycidyl Ether is a monofunctional reactive diluent derived from natural C12–C14 fatty alcohols, offering very low skin sensitization potential compared to short-chain glycidyl ethers while still effectively reducing epoxy resin viscosity. It participates in the cure reaction to build a flexible, resilient network, improving the impact resistance and peel strength of cured adhesives. Its bio-based origin and improved toxicological profile make it a preferred choice for safety-conscious formulators.
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C5 Aliphatic Hydrocarbon Tackifier Resin
CAS: 68131-77-1
C5 Aliphatic Hydrocarbon Resin is a thermoplastic tackifier polymerized from C5 piperylene and isoprene fractions obtained from steam cracking of naphtha. It provides excellent compatibility with natural rubber, SIS, and SBS block copolymers, significantly boosting tack and peel adhesion in hot-melt and solvent-based PSA formulations. Its light color, good thermal stability, and low odor make it preferred for labeling, packaging, and hygiene product adhesives.
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C9 Aromatic Hydrocarbon Tackifier Resin
CAS: 64742-16-1
C9 Aromatic Hydrocarbon Resin is a thermoplastic tackifier produced by cationic polymerization of vinyl aromatic monomers (styrene, vinyltoluene, indene) from the C9 fraction of naphtha cracking. It imparts high tack, excellent adhesion to polar substrates, and good compatibility with SBS, SBR, and neoprene rubbers. C9 resins are widely used in solvent-based adhesives, printing inks, and rubber compounding where higher aromatic content and amber color are acceptable.
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CTBN (Carboxy-Terminated Butadiene-Acrylonitrile) Liquid Rubber
CAS: 68891-46-3
CTBN Liquid Rubber is a carboxy-terminated butadiene-acrylonitrile copolymer used as a reactive toughening agent for epoxy adhesives and structural composites. When reacted with epoxy resins, CTBN phase-separates to form rubber domains that arrest crack propagation, leading to dramatic improvements in fracture toughness (KIc), peel strength, and impact resistance with minimal sacrifice of stiffness or heat resistance. It is widely employed in aerospace structural adhesives, automotive body adhesives, and electronic underfills.
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Calcium Carbonate Filler for Adhesives (Coated GCC/PCC)
CAS: 471-34-1
Coated Calcium Carbonate (GCC/PCC) is the most widely used extender filler in adhesive and sealant formulations, providing volume extension, viscosity adjustment, and improved dimensional stability at low cost. Surface coating with stearic acid or other fatty acids improves compatibility with polymer matrices and reduces moisture uptake. In silicone, polyurethane, and MS polymer sealants, fine-particle coated CaCO3 contributes to smooth extrusion, good surface finish, and balanced mechanical properties.
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Calcium Oxide (Quicklime) Moisture Scavenger
CAS: 1305-78-8
Calcium Oxide (CaO, quicklime) is a high-capacity inorganic moisture scavenger used in moisture-sensitive adhesive, sealant, and encapsulant formulations to extend shelf life and prevent premature cure. It reacts irreversibly with water to form calcium hydroxide, making it highly effective even at very low moisture levels. Fine-grade CaO is used in organic electronics encapsulants (OLED), one-component epoxy films, and polyurethane formulations where residual moisture must be minimized.
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Cationic UV-Curing Epoxy Oligomer
CAS: 25068-38-6
Cationic UV-Curing Epoxy Oligomer is an epoxy-functional resin designed for cationic photopolymerization initiated by diaryliodonium or triarylsulfonium salts. Unlike acrylate UV systems, cationic epoxy cure continues after UV exposure (dark cure), resulting in very low shrinkage, excellent adhesion to metals and glass, and outstanding chemical resistance. These systems are used in high-performance optical, electronic, and industrial UV adhesive applications requiring dimensional precision and chemical durability.
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Contact Adhesive Neoprene
CAS: 9010-98-4
Contact Adhesive Neoprene is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Cyanoacrylate Instant Adhesive
CAS: 7085-85-0
Cyanoacrylate Instant Adhesive is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
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Cycloaliphatic Epoxy Resin (3,4-Epoxycyclohexylmethyl-3,4-epoxycyclohexane Carboxylate)
CAS: 2386-87-0
Cycloaliphatic Epoxy Resin is a low-viscosity, aromatic-free difunctional epoxy offering exceptional UV stability and outdoor durability. Unlike aromatic epoxies, it resists yellowing and chalking under UV exposure, making it suitable for outdoor coatings, optical adhesives, and UV-curable systems. Cured systems exhibit high Tg, excellent electrical insulation, and very low moisture absorption.
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DMP-30 (2,4,6-Tris(dimethylaminomethyl)phenol) Epoxy Accelerator
CAS: 90-72-2
DMP-30 is a trifunctional tertiary amine and phenol accelerator widely used to catalyze epoxy curing with amines, polyamides, and anhydrides. It accelerates pot life reduction and reduces cure temperature, enabling room-temperature cure of systems that would otherwise require elevated temperatures. DMP-30 is also used as a standalone curing agent at higher loadings for rapid-cure adhesive and casting applications.
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DOP (Dioctyl Phthalate) Plasticizer for Adhesives
CAS: 117-81-7
Dioctyl Phthalate (DOP, also known as DEHP) is a general-purpose plasticizer used in adhesive and sealant formulations to impart flexibility, reduce glass transition temperature, and improve low-temperature performance. It is compatible with PVC, nitrile rubber, polysulfide, and polyurethane sealants, making it versatile across multiple adhesive technologies. In sealant formulations, DOP reduces hardness and extends service life in dynamic joint applications.
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Dibutyltin Bis(2-ethylhexanoate) (DBTEH) Catalyst
CAS: 2781-10-4
Dibutyltin Bis(2-ethylhexanoate) (DBTEH) is an organotin catalyst with lower toxicity and improved hydrolytic stability compared to DBTDL, used to accelerate cure in polyurethane and silicone adhesive and sealant systems. Its reduced tendency to hydrolyze makes it more suitable for moisture-sensitive formulations that require extended storage stability. DBTEH provides excellent catalytic activity for NCO-based reactions and is compatible with both solvent-free and solvent-borne PU systems.
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Dibutyltin Dilaurate (DBTDL) Catalyst
CAS: 77-58-7
Dibutyltin Dilaurate (DBTDL) is an organotin Lewis acid catalyst widely used to accelerate the cure of polyurethane adhesives and sealants, RTV silicone sealants, and moisture-curing silane-modified polymer systems. It catalyzes both the urethane (NCO-OH) and urea (NCO-H2O) reactions, enabling faster room-temperature cure without significantly reducing pot life at normal use levels (0.01–0.1 phr). DBTDL is the industry-standard cure catalyst for one- and two-component PU and silicone systems.
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Dicyandiamide (DICY) Latent Curing Agent
CAS: 461-58-5
Dicyandiamide (DICY) is the most widely used latent curing agent for epoxy resins, providing exceptional one-component stability at room temperature (>6 months) while curing rapidly at elevated temperatures (150–180 °C). Its fine particle size enables uniform dispersion in epoxy resin systems, giving one-part adhesive films, prepregs, and structural adhesives excellent shelf life and reproducible cure. DICY is the backbone of automotive structural adhesive films and aerospace prepreg systems.
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Dimer Acid (Dimerized Fatty Acid) Flexibilizer
CAS: 61788-89-4
Dimer Acid is a C36 dicarboxylic acid produced by dimerization of unsaturated fatty acids (primarily oleic/linoleic acid), widely used as a flexibilizer and modifier in epoxy adhesive systems. When incorporated as part of the curing agent or as a reactive flexibilizer, it introduces long aliphatic chain segments into the epoxy network, dramatically improving peel strength, impact resistance, and low-temperature flexibility. Dimer acid-based polyamide curing agents are a cornerstone of flexible epoxy adhesive technology.
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Dodecanedioic Acid (DDA) Latent Curing Agent
CAS: 693-23-2
Dodecanedioic Acid (DDA) is a solid dicarboxylic acid used as a latent curing agent for epoxy and TGIC-free powder coating systems, offering excellent storage stability and a smooth, flexible cure at 160–200 °C. When used in combination with epoxy resins, DDA produces powder coatings and adhesives with good flow, high gloss, and improved flexibility versus anhydride-cured systems. Its lower reactivity at room temperature gives outstanding one-component stability.
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EDB (Ethyl 4-(dimethylamino)benzoate) Amine Synergist
CAS: 10287-53-3
EDB (Ethyl 4-dimethylaminobenzoate) is a tertiary amine co-initiator and synergist widely used with Type II photoinitiators (benzophenone, thioxanthone) in UV adhesive and coating formulations. It donates a hydrogen atom to excited photoinitiator triplet states, dramatically accelerating surface and bulk cure rate and reducing oxygen inhibition. EDB also improves the yellowing resistance compared to aliphatic amine synergists, making it preferred for clear and light-colored UV adhesive systems.
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Epoxy Acrylate Oligomer (EA) for UV Adhesives
CAS: 55818-57-0
Epoxy Acrylate Oligomer (EA) is produced by reacting bisphenol A epoxy resin with acrylic acid, combining fast UV cure speed with high hardness, excellent chemical resistance, and strong adhesion to glass and metals. It is the most widely used UV-curable oligomer in adhesive applications, offering a high refractive index and low cure shrinkage. EA-based UV adhesives are used extensively in glass bonding, optical assemblies, electronics, and UV-curable printing ink applications.
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