Ammonium Persulfate (APS)
CAS Number: 7727-54-0
Ammonium Persulfate ((NH4)2S2O8) is the highest water-solubility persulfate salt, widely used as a redox initiator for emulsion polymerization of acrylic, VAE and SBR latexes, a microetchant for copper in printed circuit board (PCB) manufacturing, and an oxidizer for semiconductor surface cleaning. Electronic-grade APS provides clean, controlled copper dissolution with smooth surface morphology and stable etch rates, critical for fine-line PCB and flexible circuit production. The highest activity among the three commercial persulfates makes APS preferred in low-temperature redox initiator systems and in applications demanding fast oxidation kinetics. Also used in hair bleaching boosters, SDS-PAGE gel electrophoresis, and as a strong oxidant in analytical chemistry.
Technical Specifications
| Cl (ppm) | ≤30 (electronic grade ≤5) |
| Fe (ppm) | ≤2 (electronic grade ≤0.5) |
| packaging | 25 kg PE-lined kraft bag; 500/1000 kg jumbo bag; electronic grade in HDPE drum |
| appearance | White crystalline powder, free-flowing |
| moisture (%) | ≤0.1 |
| active oxygen (%) | ≥7.0 |
| purity (NH4)2S2O8 (%) | ≥99.0 |
| pH (1% solution, 25°C) | 3.0-4.5 |
| UN number / hazard class | UN 1444 / Class 5.1 oxidizer |
| heavy metals as Pb (ppm) | ≤5 |
| solubility in water (20°C, g/100g) | 58.2 |
Applications
- Redox initiator for low-temperature emulsion polymerization (paired with sodium bisulfite or TMEDA)
- Thermal initiator for acrylic latex, VAE dispersions, SBR and NBR rubber latex production
- Copper microetching for printed circuit board (PCB) manufacturing - inner layer black oxide alternative, soft etch before solder mask
- Semiconductor wafer surface cleaning and photoresist stripping
- Initiator for SDS-PAGE polyacrylamide gel electrophoresis in biotech labs
- Hair bleaching booster and oxidizer in analytical chemistry (Mn determination, BOD/COD)
Key Features
- Highest activity and water solubility of the three commercial persulfates - ideal for fast-kinetics applications
- Electronic grade with ultra-low Fe and Cl meets PCB and semiconductor specifications
- Clean copper etching with smooth microroughness - critical for fine-pitch and HDI PCB
- Excellent redox-pair partner with bisulfite/metabisulfite for low-temperature polymerization (<40 C)
- Ammonia by-product easily removed by evaporation, leaving clean polymer product
- UN 1444 Class 5.1 oxidizer, ocean-shipment ready
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CAS Number
7727-54-0
Category
Polymer Synthesis ChemicalsAvailability
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