Die Attach Adhesive
CAS Number: 25068-38-6
Die attach adhesive is a high-performance epoxy or silicone-based adhesive used to bond semiconductor dies to leadframes, substrates, or package bases during IC assembly. It provides strong mechanical bonding, thermal conductivity, and electrical isolation or conductivity depending on formulation. Critical for ensuring die stability and heat dissipation in packaged semiconductor devices.
Technical Specifications
| viscosity | 50,000–300,000 cP |
| appearance | Paste, black or transparent |
| voidContent | <1% after cure |
| bondStrength | >30 MPa (die shear) |
| cureCondition | 150–175°C / 60–120 min |
| thermalConductivity | 1–5 W/m·K |
Applications
- Semiconductor die bonding to leadframes
- Multi-chip module assembly
- Power device packaging
- MEMS sensor die attachment
- Optoelectronic component assembly
Key Features
- Low void content for reliable heat dissipation
- High die shear strength for mechanical integrity
- Available in thermally or electrically conductive grades
- Compatible with standard cure profiles and dispensing equipment