Copper Plating Additive
CAS Number: 7758-98-7
Copper plating additive is a proprietary blend of brighteners, levelers, and suppressors used in acid copper electroplating baths to produce smooth, bright, void-free copper deposits for PCB via filling and surface plating. It ensures uniform copper distribution across the entire board, including high aspect ratio vias, and provides deposits with excellent ductility for thermal cycling reliability. Used in both pattern plating and panel plating processes.
Technical Specifications
| dosage | 5–20 mL/L (brightener), 1–5 mL/L (leveler) |
| appearance | Clear to slightly blue liquid concentrate |
| operatingTemp | 20–30°C |
| currentDensity | 1–5 A/dm² |
| depositElongation | >15% (IPC-TM-650) |
| depositTensileStrength | >250 MPa |
Applications
- PCB via filling by copper electroplating
- PCB pattern and panel plating
- High aspect ratio through-hole plating
- HDI microvia copper filling
- Semiconductor wafer copper damascene plating
Key Features
- Uniform copper distribution in high aspect ratio vias
- High deposit ductility for thermal cycle reliability
- Void-free filling of blind microvias
- Compatible with insoluble anode and soluble anode systems