Electronic / Semiconductor Additives
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electronic semiconductor additives
Acrylic Conformal Coating
CAS: 9003-01-4
Acrylic conformal coating is a transparent protective polymer coating applied to PCBs to shield electronic assemblies from moisture, dust, chemicals, and temperature extremes. Based on acrylic resin chemistry, it offers excellent clarity, easy reworkability with common solvents, and rapid air-dry or UV cure. It is the most widely used conformal coating type in consumer and industrial electronics.
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Anisotropic Conductive Film (ACF)
CAS: 25068-38-6
Anisotropic conductive film (ACF) is a thin adhesive film containing conductive particles that provides electrical connection only in the Z-axis (thickness direction) while remaining insulating in the X-Y plane. It is used to bond and electrically connect flex circuits, LCD driver ICs, and chip-on-glass assemblies to substrates without solder. The thermocompression bonding process aligns particles between facing contact pads.
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Anti-Static Coating for Electronics
CAS: 25322-68-3
Anti-static coating for electronics is a dissipative or conductive polymer coating applied to PCBs, packaging, and electronic housings to prevent electrostatic discharge (ESD) damage to sensitive components. It provides a controlled surface resistivity in the range of 10⁵–10¹¹ Ω/sq, safely dissipating static charges. Meets ANSI/ESD S20.20 and IEC 61340 standards for ESD-safe manufacturing environments.
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CMP Slurry for Metal
CAS: 1344-28-1
CMP slurry for metal is a chemically active abrasive suspension designed for polishing copper, tungsten, or other metal interconnect layers during semiconductor fabrication. It uses complexing agents and oxidizers in combination with abrasive particles to achieve controlled metal removal and planarization. Critical for damascene copper interconnect formation in advanced logic nodes and tungsten plug CMP in memory devices.
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CMP Slurry for Oxide
CAS: 7631-86-9
CMP (chemical mechanical planarization) slurry for oxide is a colloidal silica or ceria-based abrasive suspension used to planarize silicon dioxide and other dielectric films on semiconductor wafers. It combines mechanical abrasion with chemical dissolution to achieve global planarization required for multi-layer IC fabrication. Critical for STI, ILD, and PMD planarization in advanced logic and memory devices.
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Carbon Conductive Paste
CAS: 1333-86-4
Carbon conductive paste is a cost-effective, screen-printable formulation of carbon black or graphite particles dispersed in a polymer binder, used for printing resistive elements, shielding layers, and electrode contacts in electronic devices. It provides tunable sheet resistance across a wide range and is compatible with flexible and rigid substrates. Commonly used in membrane switches, biosensors, and printed heating elements.
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Copper Etching Chemical
CAS: 7758-98-7
Copper etching chemical is an acidic or alkaline solution used to selectively remove unwanted copper from PCB surfaces during the pattern formation process. Alkaline ammoniacal etchants are preferred for inner layers, while cupric chloride or ferric chloride systems are used in various production environments. Controlled etch rate and undercut characteristics are critical for achieving fine line and space resolution.
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Copper Plating Additive
CAS: 7758-98-7
Copper plating additive is a proprietary blend of brighteners, levelers, and suppressors used in acid copper electroplating baths to produce smooth, bright, void-free copper deposits for PCB via filling and surface plating. It ensures uniform copper distribution across the entire board, including high aspect ratio vias, and provides deposits with excellent ductility for thermal cycling reliability. Used in both pattern plating and panel plating processes.
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Defluxer Agent
CAS: 111-76-2
Defluxer agent is a specialized solvent or aqueous solution formulated to dissolve and remove flux residues from PCBs and electronic assemblies after soldering operations. It effectively targets rosin-based, water-soluble, and no-clean flux residues while being safe for sensitive components and substrates. Available in aerosol, liquid concentrate, and ready-to-use formats.
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Die Attach Adhesive
CAS: 25068-38-6
Die attach adhesive is a high-performance epoxy or silicone-based adhesive used to bond semiconductor dies to leadframes, substrates, or package bases during IC assembly. It provides strong mechanical bonding, thermal conductivity, and electrical isolation or conductivity depending on formulation. Critical for ensuring die stability and heat dissipation in packaged semiconductor devices.
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Dielectric Coating
CAS: 63148-62-9
Dielectric coating is an electrically insulating polymer or ceramic thin film applied to electronic substrates, PCBs, and semiconductor surfaces to provide electrical isolation, voltage withstand, and environmental protection. Formulations include polyimide, parylene, and silicone-based systems offering different combinations of dielectric constant, thermal stability, and mechanical flexibility. Used where conformal insulating coverage is required on complex geometries.
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EMI Shielding Coating
CAS: 7440-22-4
EMI shielding coating is a conductive paint or spray formulation containing silver, copper, or nickel particles designed to attenuate electromagnetic interference on PCBs, enclosures, and electronic housings. It provides effective shielding effectiveness typically exceeding 60 dB across a broad frequency range. Used extensively in telecommunications, medical devices, and automotive electronics to meet EMC regulatory requirements.
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ENIG Surface Finish (Electroless Nickel Immersion Gold)
CAS: 7440-02-0
ENIG (Electroless Nickel Immersion Gold) is a two-layer PCB surface finish consisting of a 3–6 µm electroless nickel layer topped with a thin 0.05–0.15 µm immersion gold layer. The nickel provides a flat, solderable surface and a diffusion barrier, while the gold protects the nickel from oxidation and ensures excellent solderability. ENIG is the most widely used surface finish for fine-pitch SMT and wire bonding applications.
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Electrically Conductive Adhesive
CAS: 7440-22-4
Electrically conductive adhesive (ECA) is a silver or carbon-filled polymer adhesive used as a solder alternative for bonding and electrically interconnecting electronic components. It provides reliable low-resistance electrical contact while curing at temperatures well below lead-free solder reflow, making it suitable for heat-sensitive components and flexible substrates. Available in isotropic and anisotropic grades.
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Electroless Nickel Additive
CAS: 13477-29-7
Electroless nickel additive is a stabilizer, brightener, and complexant package used in electroless nickel plating baths to maintain consistent deposition rate, phosphorus content, and deposit quality for PCB and semiconductor applications. It ensures uniform nickel deposition across complex topographies without an external current source. The phosphorus content is controlled by additive composition to achieve low (2–4%), mid (6–9%), or high (10–12%) phosphorus grades.
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Electronic Cleaning Solvent
CAS: 67-63-0
Electronic cleaning solvent is a precision-grade solvent blend formulated to remove contamination from sensitive electronic components, PCBs, and semiconductor substrates without leaving residues or causing damage. Formulations include IPA-based, HFE-based, and nPB-free alternatives that offer fast evaporation, low toxicity, and excellent compatibility with electronic materials. Used in maintenance, rework, and precision cleaning applications.
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Electronic Grade Silicone Gel
CAS: 63148-62-9
Electronic grade silicone gel is an ultra-soft, lightly cross-linked silicone encapsulant that provides gentle, stress-free protection for delicate semiconductor devices and sensitive electronic assemblies. Its gel-like consistency allows components to flex without delamination, while providing excellent dielectric properties and protection from moisture and contamination. Widely used in automotive power modules, IGBT modules, and sensor packaging.
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Epoxy Conformal Coating
CAS: 25068-38-6
Epoxy conformal coating provides the hardest and most chemically resistant protective film among standard conformal coating types, offering outstanding protection in aggressive chemical and abrasive environments. Its two-component system cures to a rigid, impermeable film with excellent adhesion to FR4, ceramics, and metal substrates. It is particularly suited for downhole oil and gas electronics and chemical processing instrumentation.
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Epoxy Potting Compound
CAS: 25068-38-6
Epoxy potting compound is a two-component encapsulant poured around electronic assemblies to provide mechanical protection, moisture exclusion, thermal management, and chemical resistance. Upon cure it forms a rigid, durable mass that permanently encases sensitive electronics from environmental and mechanical stresses. Widely used in transformers, sensors, connectors, and outdoor LED drivers.
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Gold Finger Protective Coating
CAS: 13453-07-1
Gold finger protective coating is a hard gold electroplating solution or post-treatment used to protect PCB edge connector contacts (gold fingers) from wear, oxidation, and contact resistance degradation over thousands of insertion cycles. The cobalt-hardened gold deposit meets IPC-4552 and MIL-G-45204 specifications for contact finishes. Applied over a nickel barrier layer to prevent copper diffusion into the gold.
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Gold Plating Additive
CAS: 13453-07-1
Gold plating additive is used in hard or soft gold electroplating baths to control grain structure, hardness, and deposit purity for PCB contact fingers, wire bond pads, and connector surfaces. Hard gold additives incorporate cobalt or nickel co-deposition for wear resistance, while soft gold additives produce high-purity deposits suitable for wire bonding. Used across semiconductor packaging, PCB surface finish, and high-reliability connector applications.
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HASL Surface Finish (Hot Air Solder Leveling)
CAS: 7440-31-5
HASL (Hot Air Solder Leveling) is a PCB surface finish process where bare copper pads are coated with molten solder and excess solder is removed by hot air knives, leaving a solderable tin-lead or lead-free solder coating. It is one of the oldest and most cost-effective PCB surface finishes, providing excellent solderability and long shelf life. Lead-free HASL uses SAC alloys to comply with RoHS requirements.
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Hafnium ALD Precursor
CAS: 69038-57-9
Hafnium ALD precursor is a volatile organometallic compound used in atomic layer deposition (ALD) to grow ultra-thin hafnium oxide (HfO₂) high-k dielectric films for advanced gate dielectrics and DRAM capacitors. Common precursors include TEMAH and HfCl₄, which react with water or ozone oxidants to deposit conformal, pinhole-free HfO₂ at low temperatures. Essential for sub-10 nm CMOS logic and high-density memory fabrication.
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Immersion Silver Additive
CAS: 7761-88-8
Immersion silver additive is a complexant and anti-tarnish package for immersion silver PCB surface finish baths, depositing a thin 0.1–0.4 µm silver layer on copper pads via displacement plating. The anti-tarnish organic inclusion in the deposit prevents silver sulfidation and maintains solderability during storage. Immersion silver provides excellent electrical performance for high-frequency applications and is compatible with all soldering methods.
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Immersion Tin Additive
CAS: 7772-99-8
Immersion tin additive is a stabilizer and complexant system for immersion tin PCB surface finish baths, producing a thin, flat, solderable tin deposit on copper pads via displacement reaction. It prevents whisker growth and tin-copper intermetallic formation through thiourea-based or alternative complexant chemistries. Immersion tin provides excellent fine-pitch solderability and is a lead-free, RoHS-compliant surface finish.
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LED Encapsulant
CAS: 63148-62-9
LED encapsulant is an optically transparent silicone or epoxy resin used to protect LED chips and phosphors while maximizing light extraction efficiency. It must maintain optical clarity and yellowing resistance under prolonged UV and thermal exposure, with a refractive index matched to semiconductor chips. Available in soft and hard grades for various LED package formats including SMD, COB, and high-power modules.
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Low-k Dielectric Additive
CAS: 17689-77-9
Low-k dielectric additive is a pore-generating or matrix-modifying chemical incorporated into dielectric thin films to reduce the dielectric constant (k) below 3.0 for advanced semiconductor interconnect layers. Reducing k lowers RC delay and cross-talk in dense IC metallization. Porogen-based additives introduce controlled nanopores into CVD or spin-on dielectric matrices to achieve ultra-low-k (ULK) values.
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Nickel Plating Additive
CAS: 7786-81-4
Nickel plating additive is a formulated blend of organic brighteners and stress reducers for Watts or sulfamate nickel electroplating baths, producing semi-bright to fully bright, low-stress nickel deposits for electronic components and PCB surface finishes. It provides a diffusion barrier layer in gold plating sequences and serves as a corrosion-resistant undercoat. Used in connector plating, PCB edge connectors, and lead-frame finishing.
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No-Clean Flux
CAS: 8050-09-7
No-clean flux is a low-residue soldering flux formulated to leave minimal, electrically safe residues that do not require post-solder cleaning. It promotes excellent solder wetting on copper, tin, and other metallic surfaces while maintaining high insulation resistance. Widely used in surface mount technology (SMT) and through-hole assembly processes.
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PCB Anti-Tarnish Agent
CAS: 95-14-7
PCB anti-tarnish agent is a thin organic surface treatment applied to bare copper and metal surfaces on PCBs to prevent oxidation and tarnishing during storage and handling before assembly. Based on benzotriazole or imidazole chemistry, it forms a monomolecular protective layer that is soldering-compatible and does not impair wettability. Critical for maintaining solderability during long storage periods.
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PCB Cleaner
CAS: 67-63-0
PCB cleaner is a precision electronic cleaning agent designed to remove flux residues, ionic contaminants, and particulate matter from printed circuit boards after soldering. Formulated as low-toxicity, fast-evaporating solvent blends or aqueous systems, these cleaners leave no residue and are safe for sensitive electronic components. They meet IPC cleanliness standards and support both batch and inline cleaning processes.
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PCB Legend Ink
CAS: 25036-25-3
PCB legend ink is a screen-printable or inkjet-printable epoxy or acrylic ink used to print component reference designators, polarity marks, and logos on PCB surfaces. It must adhere strongly to solder mask, resist soldering temperatures, and remain legible after assembly processes. Available in white, yellow, and black formulations for both conventional and UV-cure printing methods.
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Photoresist Stripper
CAS: 872-50-4
Photoresist stripper is a solvent or alkaline aqueous solution used to remove photoresist films from semiconductor wafers, PCBs, and flat panel display substrates after patterning and etching steps. It must completely dissolve or lift off both exposed and unexposed resist without damaging underlying metal layers or dielectrics. Available in NMP-based, solvent-blend, and aqueous alkaline formulations for various resist types.
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Polyurethane Conformal Coating
CAS: 9009-54-5
Polyurethane conformal coating delivers superior chemical resistance and abrasion resistance compared to acrylic alternatives, making it ideal for harsh industrial and automotive environments. It forms a tough, flexible film with excellent moisture and solvent barrier properties. Both solvent-borne and water-borne formulations are available to meet varying VOC and application requirements.
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Semiconductor Encapsulant
CAS: 25068-38-6
Semiconductor encapsulant is an epoxy molding compound or liquid encapsulant used to protect semiconductor dies and wire bonds from mechanical damage, moisture, and contamination in final package assembly. It provides excellent adhesion to die surfaces, leadframes, and substrates while maintaining low ionic impurity levels critical for long-term device reliability. Used in QFP, DIP, SOP, and advanced IC packages.
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Silicon CVD Precursor
CAS: 992-94-9
Silicon CVD precursor is a volatile silicon-containing compound such as silane (SiH₄), TEOS, or DCS used in chemical vapor deposition to grow silicon, silicon dioxide, silicon nitride, and polysilicon films on semiconductor wafers. These films serve as gate electrodes, dielectrics, passivation layers, and structural elements in MEMS. High purity is mandatory to avoid device performance degradation from trace metallic contaminants.
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Silicone Conformal Coating
CAS: 63148-62-9
Silicone conformal coating provides outstanding protection for PCBs operating in extreme temperature environments, offering a wide service range from -65°C to +200°C. Its flexible, rubber-like film resists thermal cycling fatigue and provides excellent dielectric properties even at high humidity. Preferred for aerospace, automotive under-hood, and high-temperature industrial applications.
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Silicone Potting Compound
CAS: 63148-62-9
Silicone potting compound is a flexible, thermally stable encapsulant used for embedding sensitive electronic assemblies that require protection from moisture, vibration, and thermal cycling without imposing rigid mechanical constraints. Its low modulus and excellent thermal stability from -60°C to +200°C make it ideal for automotive, aerospace, and high-power electronics. Both addition-cure and condensation-cure grades are available.
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Silicone Thermal Pad
CAS: 63148-62-9
Silicone thermal pad is a pre-formed, thermally conductive sheet material used as a solid-form thermal interface between electronic components and heatsinks. Unlike paste-form TIMs, thermal pads are clean, easy to handle, and provide consistent bond line thickness for high-volume manufacturing. They combine the softness of silicone with ceramic or metallic thermal filler particles for effective heat dissipation.
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Silver Conductive Paste
CAS: 7440-22-4
Silver conductive paste is a screen-printable or dispensable formulation of fine silver particles in a polymer binder, providing high electrical conductivity for printed electronics, solar cells, and hybrid circuit applications. Upon curing or sintering, the silver particles form a low-resistance conductive network. It is the industry standard for front-side metallization of silicon solar cells and thick-film circuit fabrication.
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Solder Mask Ink
CAS: 25036-25-3
Solder mask ink is a photoimageable or thermally cured polymer coating applied to PCB surfaces to protect copper traces from oxidation and prevent solder bridging during assembly. It defines the solderable pad openings with high precision and provides long-term electrical insulation and chemical resistance. Available in liquid photoimageable (LPI) and dry film formats with green, red, blue, and black color options.
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Solder Paste Flux
CAS: 8050-09-7
Solder paste flux is a specially formulated rosin or synthetic resin flux vehicle used as the carrier medium in solder paste for SMT applications. It provides oxide removal, thermal stability during reflow, and controlled rheology for stencil printing. The flux system ensures reliable solder joint formation and is available in no-clean and water-washable grades.
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Spin-On Glass (SOG)
CAS: 7631-86-9
Spin-on glass (SOG) is a silica-based solution deposited by spin coating on semiconductor wafers and cured to form a planarizing silicon oxide film for gap-fill and interlayer dielectric (ILD) applications. It provides excellent gap-fill capability for sub-micron features without the need for high-vacuum deposition equipment. Available in silicate, siloxane, and hydrogen silsesquioxane (HSQ) chemistries.
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TMAH Photoresist Developer
CAS: 75-59-2
TMAH (tetramethylammonium hydroxide) photoresist developer is the industry-standard aqueous alkaline developer for positive-tone photoresists in semiconductor and flat panel display manufacturing. It precisely develops exposed resist regions without leaving metallic ion contamination, making it compatible with CMOS processes. Supplied as 2.38% standard concentration for most photoresist systems, with alternative concentrations for specialized processes.
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Thermal Interface Material
CAS: 1344-28-1
Thermal interface material (TIM) is a thermally conductive compound or paste applied between heat-generating electronic components and heatsinks to minimize thermal contact resistance. Filled with alumina, zinc oxide, or boron nitride particles, TIMs fill microscopic air gaps and surface irregularities that otherwise impede heat flow. Critical for CPUs, GPUs, power semiconductors, and LED modules where thermal management is paramount.
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Thermally Conductive Adhesive
CAS: 25068-38-6
Thermally conductive adhesive is an epoxy or silicone-based formulation filled with thermally conductive fillers such as alumina, boron nitride, or silver to facilitate heat transfer from electronic components to heatsinks or substrates. It combines structural bonding with efficient thermal management, eliminating the need for separate mechanical fasteners. Widely used in power electronics, LED assemblies, and computing hardware.
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UV Curing Ink for Electronics
CAS: 7473-98-5
UV curing ink for electronics is a radiation-curable formulation used in inkjet or screen printing of functional layers on PCBs, flexible circuits, and electronic substrates. It cures instantly under UV or LED-UV irradiation, enabling high-throughput production of solder masks, dielectric layers, and decorative markings. Designed for excellent adhesion to copper and laminate surfaces with high chemical resistance after cure.
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Underfill Epoxy
CAS: 25068-38-6
Underfill epoxy is a capillary or no-flow epoxy encapsulant dispensed beneath flip-chip, BGA, and CSP packages to redistribute thermal and mechanical stress across solder joints, dramatically improving fatigue life. It fills the gap between the chip and the substrate by capillary action and cures to a rigid, hermetically sealed structure. Critical for high-reliability mobile, server, and automotive applications.
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Via Fill Epoxy
CAS: 25068-38-6
Via fill epoxy is a specialized thermosetting epoxy paste used to plug through-holes and blind vias in PCBs to create a planar surface suitable for component mounting and fine-pitch interconnection. It eliminates via-in-pad solder wicking problems and enables higher routing density in HDI designs. Formulated with controlled CTE and low void content for reliable thermal cycling performance.
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Water-Soluble Flux
CAS: 110-17-8
Water-soluble flux is a highly active soldering flux designed for demanding applications where maximum wetting is required; residues are fully removable with deionized water. Its organic acid activators provide exceptional soldering performance on difficult-to-solder surfaces including oxidized metals. Post-solder aqueous cleaning ensures no ionic contamination on the final assembly.
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