LED Encapsulant
CAS Number: 63148-62-9
LED encapsulant is an optically transparent silicone or epoxy resin used to protect LED chips and phosphors while maximizing light extraction efficiency. It must maintain optical clarity and yellowing resistance under prolonged UV and thermal exposure, with a refractive index matched to semiconductor chips. Available in soft and hard grades for various LED package formats including SMD, COB, and high-power modules.
Technical Specifications
| Tg | 50–120°C |
| hardness | Shore A 10–Shore D 70 (grade dependent) |
| appearance | Clear, water-white liquid |
| transmittance | >95% at 450 nm (1 mm film) |
| refractiveIndex | 1.40–1.54 |
| yellowingResistance | <ΔYI 2 after 1000h at 150°C |
Applications
- SMD LED chip encapsulation
- COB LED module encapsulation
- High-power LED array potting
- Phosphor-in-silicone remote phosphor plates
- UV LED and deep-UV device encapsulation
Key Features
- High optical transparency for maximum light extraction
- Excellent yellowing resistance under UV and thermal aging
- Refractive index options to optimize light coupling
- Compatible with all common phosphor types and LED chips