Silicone Potting Compound
CAS Number: 63148-62-9
Silicone potting compound is a flexible, thermally stable encapsulant used for embedding sensitive electronic assemblies that require protection from moisture, vibration, and thermal cycling without imposing rigid mechanical constraints. Its low modulus and excellent thermal stability from -60°C to +200°C make it ideal for automotive, aerospace, and high-power electronics. Both addition-cure and condensation-cure grades are available.
Technical Specifications
| hardness | Shore A 15–60 |
| viscosity | 1,000–20,000 cP |
| appearance | Clear, white, or grey gel/liquid |
| cureCondition | RTV or 60–150°C / 30–60 min |
| thermalConductivity | 0.2–1.0 W/m·K |
| operatingTemperature | -60°C to +200°C |
Applications
- Automotive sensor and ECU potting
- Aerospace avionics encapsulation
- High-power LED module potting
- Downhole electronics sealing
- Flexible circuit board encapsulation
Key Features
- Flexible cure accommodates thermal cycling and vibration
- Wide operating temperature range -60°C to +200°C
- Low stress on delicate components
- Self-priming grades adhere without primer to most substrates