Epoxy Potting Compound
CAS Number: 25068-38-6
Epoxy potting compound is a two-component encapsulant poured around electronic assemblies to provide mechanical protection, moisture exclusion, thermal management, and chemical resistance. Upon cure it forms a rigid, durable mass that permanently encases sensitive electronics from environmental and mechanical stresses. Widely used in transformers, sensors, connectors, and outdoor LED drivers.
Technical Specifications
| potLife | 30–90 min at 25°C |
| hardness | Shore D 60–85 |
| mixRatio | 2:1 or 4:1 (A:B by weight) |
| appearance | Black or clear two-component liquid |
| mixedViscosity | 500–5000 cP |
| operatingTemperature | -40°C to +155°C |
Applications
- Power transformer and inductor potting
- Outdoor sensor and junction box encapsulation
- LED driver module potting
- Military electronics environmental sealing
- Connector and cable termination potting
Key Features
- Rigid, permanent protection against moisture and chemicals
- Excellent electrical insulation properties
- Good adhesion to most housings and substrates
- UL 94 V-0 flame-retardant grades available