Semiconductor Encapsulant
CAS Number: 25068-38-6
Semiconductor encapsulant is an epoxy molding compound or liquid encapsulant used to protect semiconductor dies and wire bonds from mechanical damage, moisture, and contamination in final package assembly. It provides excellent adhesion to die surfaces, leadframes, and substrates while maintaining low ionic impurity levels critical for long-term device reliability. Used in QFP, DIP, SOP, and advanced IC packages.
Technical Specifications
| Tg | 140–180°C |
| CTE | 8–20 ppm/°C |
| appearance | Black or clear pellets/liquid |
| ionicPurity | Cl⁻ <5 ppm, Na⁺ <5 ppm |
| flexuralStrength | >130 MPa |
| moistureAbsorption | <0.3% (85°C/85%RH, 168h) |
Applications
- IC package molding (QFP, DIP, SOP)
- Glob-top wire bond protection
- Power module encapsulation
- MEMS device sealing
- Sensor package encapsulation
Key Features
- Ultra-low ionic impurity for device reliability
- Matched CTE reduces package stress
- High Tg for reliability under thermal cycling
- Halogen-free, green package grades available