Gold Plating Additive
CAS Number: 13453-07-1
Gold plating additive is used in hard or soft gold electroplating baths to control grain structure, hardness, and deposit purity for PCB contact fingers, wire bond pads, and connector surfaces. Hard gold additives incorporate cobalt or nickel co-deposition for wear resistance, while soft gold additives produce high-purity deposits suitable for wire bonding. Used across semiconductor packaging, PCB surface finish, and high-reliability connector applications.
Technical Specifications
| hardness | 60–90 HV (soft), 150–200 HV (hard) |
| thickness | 0.05–1.27 µm (typical) |
| appearance | Clear to pale yellow liquid |
| goldContent | 2–8 g/L (as Au) |
| depositPurity | >99.9% Au (soft gold) |
| operatingTemp | 50–65°C |
Applications
- PCB gold finger contact plating
- Wire bond pad soft gold plating
- Semiconductor package hard gold plating
- High-reliability connector gold finish
- ENIG and ENEPIG process hard gold top layer
Key Features
- Hard gold for wear-resistant connector contacts
- Soft gold with >99.9% purity for wire bonding
- Stable bath with long operating life
- Cyanide-free formulations available