Nickel Plating Additive
CAS Number: 7786-81-4
Nickel plating additive is a formulated blend of organic brighteners and stress reducers for Watts or sulfamate nickel electroplating baths, producing semi-bright to fully bright, low-stress nickel deposits for electronic components and PCB surface finishes. It provides a diffusion barrier layer in gold plating sequences and serves as a corrosion-resistant undercoat. Used in connector plating, PCB edge connectors, and lead-frame finishing.
Technical Specifications
| pH | 3.8–4.5 |
| dosage | 2–10 mL/L |
| appearance | Clear to pale yellow liquid |
| operatingTemp | 45–60°C |
| internalStress | <100 MPa (tensile) |
| depositHardness | 200–400 HV (bright grade) |
Applications
- PCB edge connector nickel underlayer
- Electronic connector component plating
- Lead frame surface finishing
- Decorative and functional nickel plating
- Diffusion barrier in ENIG process
Key Features
- Semi-bright or fully bright deposit options
- Low deposit stress reduces plating cracking risk
- Excellent corrosion resistance as undercoat
- Stable bath chemistry with wide operating window