Electroless Nickel Additive
CAS Number: 13477-29-7
Electroless nickel additive is a stabilizer, brightener, and complexant package used in electroless nickel plating baths to maintain consistent deposition rate, phosphorus content, and deposit quality for PCB and semiconductor applications. It ensures uniform nickel deposition across complex topographies without an external current source. The phosphorus content is controlled by additive composition to achieve low (2–4%), mid (6–9%), or high (10–12%) phosphorus grades.
Technical Specifications
| pH | 4.5–5.0 |
| dosage | 5–20 mL/L |
| appearance | Clear to pale yellow liquid |
| bathStability | >6 MTO (metal turnover) |
| depositionRate | 12–18 µm/h at 85°C |
| phosphorusContent | 6–9 wt% (mid-P standard grade) |
Applications
- ENIG PCB nickel underlayer
- Electroless nickel on aluminum substrates
- Semiconductor wafer UBM (under bump metallization)
- Hard disk drive electroless nickel coating
- Precision engineering component plating
Key Features
- Consistent phosphorus content over bath life
- High bath stability with low spontaneous decomposition risk
- Excellent deposit uniformity on complex shapes
- Available in low, mid, and high phosphorus grades