No-Clean Flux
CAS Number: 8050-09-7
No-clean flux is a low-residue soldering flux formulated to leave minimal, electrically safe residues that do not require post-solder cleaning. It promotes excellent solder wetting on copper, tin, and other metallic surfaces while maintaining high insulation resistance. Widely used in surface mount technology (SMT) and through-hole assembly processes.
Technical Specifications
| pH | 3.5–5.5 |
| appearance | Clear to light amber liquid |
| flashPoint | >40°C |
| solidsContent | 1–5 wt% |
| halidesContent | Halide-free or <0.05% |
| specificGravity | 0.78–0.85 g/cm³ |
Applications
- Surface mount technology (SMT) assembly
- Through-hole soldering
- Wave soldering processes
- Selective soldering systems
- PCB rework and repair
Key Features
- No post-solder cleaning required, reducing process cost
- Excellent wetting and spreading on oxidized surfaces
- High insulation resistance of residues
- Compatible with a wide range of solder alloys