Solder Paste Flux
CAS Number: 8050-09-7
Solder paste flux is a specially formulated rosin or synthetic resin flux vehicle used as the carrier medium in solder paste for SMT applications. It provides oxide removal, thermal stability during reflow, and controlled rheology for stencil printing. The flux system ensures reliable solder joint formation and is available in no-clean and water-washable grades.
Technical Specifications
| slump | <0.1 mm at 25°C |
| tackForce | 30–60 gf (IPC test method) |
| viscosity | 500–900 Pa·s |
| appearance | Pale yellow to amber paste/gel |
| metalContent | 85–92 wt% |
| particleSize | Type 3 (25–45 µm) or Type 4 (20–38 µm) |
Applications
- SMT reflow soldering
- BGA and CSP rework
- Fine-pitch component assembly
- Stencil printing processes
- Flip-chip soldering
Key Features
- Excellent stencil printing and release characteristics
- Long stencil life and good open-time performance
- Controlled slump for fine-pitch reliability
- Available in no-clean and water-washable formulations