Silicone Thermal Pad
CAS Number: 63148-62-9
Silicone thermal pad is a pre-formed, thermally conductive sheet material used as a solid-form thermal interface between electronic components and heatsinks. Unlike paste-form TIMs, thermal pads are clean, easy to handle, and provide consistent bond line thickness for high-volume manufacturing. They combine the softness of silicone with ceramic or metallic thermal filler particles for effective heat dissipation.
Technical Specifications
| hardness | Shore 00 20–45 |
| thickness | 0.5–5.0 mm (standard range) |
| appearance | White, blue, or grey flexible sheet |
| dielectricStrength | >10 kV/mm |
| thermalConductivity | 1.5–15 W/m·K |
| operatingTemperature | -40°C to +200°C |
Applications
- PCB component-to-heatsink interface
- Power supply module thermal management
- Notebook and desktop CPU thermal interface
- EV battery module cell-to-cell thermal management
- 5G base station power amplifier cooling
Key Features
- Clean, no-mess alternative to thermal paste
- Consistent bond-line thickness in mass production
- Electrically insulating for safe component contact
- Compressible to fill surface irregularities