Silver Conductive Paste
CAS Number: 7440-22-4
Silver conductive paste is a screen-printable or dispensable formulation of fine silver particles in a polymer binder, providing high electrical conductivity for printed electronics, solar cells, and hybrid circuit applications. Upon curing or sintering, the silver particles form a low-resistance conductive network. It is the industry standard for front-side metallization of silicon solar cells and thick-film circuit fabrication.
Technical Specifications
| viscosity | 100–500 Pa·s |
| appearance | Gray silver paste |
| resistivity | <5×10⁻⁵ Ω·cm (cured) |
| particleSize | 1–10 µm (D50) |
| cureCondition | 120°C / 30 min or 850°C sintering |
| silverContent | 70–85 wt% |
Applications
- Silicon solar cell front-side metallization
- Thick-film resistor and conductor printing
- RFID antenna and tag fabrication
- Touch screen electrode printing
- Hybrid and multi-layer circuit fabrication
Key Features
- High silver content for excellent electrical conductivity
- Screen-printable with fine line resolution
- Available in low-temperature and high-temperature sintering grades
- Long shelf life with stable rheology