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DOPO (9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide)

CAS Number: 35455-29-9

DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) is the key reactive phosphorus intermediate used to synthesize a broad family of halogen-free flame retardants for epoxy resins, polyesters, and vinyl ester resins. Its reactive P–H bond allows covalent incorporation into epoxy hardeners, novolacs, and vinyl ester backbones, providing permanent non-leachable flame retardancy. DOPO-based FR systems are the dominant approach in halogen-free printed circuit board (PCB) and copper clad laminate (CCL) manufacturing.

Technical Specifications

appearanceWhite crystalline solid
moisture (%)<0.2
purity (GC, %)≥99
melting point (°C)117–120
acid value (mgKOH/g)<0.5
phosphorus content (%)14.3–14.7

Applications

  • Reactive halogen-free FR intermediate for PCB and copper clad laminate (CCL) epoxy systems
  • Synthesis of DOPO-based epoxy hardeners and curing agents for electronics
  • Flame-retardant vinyl ester resin formulations for FRP composite panels
  • Reactive FR additive for polyester and PBT fiber and film applications
  • Building block for DOPO-HQ, DOPO-BQ, and other advanced reactive FR derivatives

Key Features

  • Reactive P–H functionality allows covalent incorporation into thermoset resins for permanent FR without leaching
  • Compact bicyclic phosphine oxide structure delivers high phosphorus efficiency in aromatic polymer systems
  • Foundation molecule for the entire DOPO-derivative halogen-free FR family used in PCB manufacturing
  • High purity (>99%) ensures reproducible reactivity in epoxy laminate and prepreg production

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DOPO (9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) chemical structure

CAS Number

35455-29-9

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