DOPO-HQ (2-(6-Oxido-6H-dibenz[c,e][1,2]oxaphosphorin-6-yl)hydroquinone)

Name: DOPO-HQ (2-(6-Oxido-6H-dibenz[c,e][1,2]oxaphosphorin-6-yl)hydroquinone)
Brand: Chemzip
Price: 1 USD
Availability: InStock

CAS Number: 98006-68-5

Featured inFlame Retardants

DOPO-HQ is a solid, reactive halogen-free flame retardant derived from the addition of DOPO to benzoquinone, offering two reactive hydroxyl groups for covalent incorporation into epoxy resin networks as a co-curing agent. It provides excellent flame retardancy at low phosphorus loadings (0.8–1.5% P content in cured system) while maintaining high glass transition temperature (Tg) and thermal stability required for high-reliability PCB laminates. DOPO-HQ is widely specified in Halogen-Free CCL products meeting IEC 61249-2-21 and IPC-4101E standards.

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Technical Specifications

appearance	White to off-white crystalline powder
moisture (%)	<0.3
purity (HPLC, %)	≥98
melting point (°C)	245–255
phosphorus content (%)	9.0–9.5
hydroxyl equivalent weight (g/eq)	155–165

Applications

Halogen-free copper clad laminate (CCL) epoxy systems for PCB manufacturing
High-Tg epoxy prepreg for multi-layer PCBs in telecommunications and server equipment
Reactive FR co-curing agent in aerospace structural epoxy composite prepregs
Encapsulant and underfill epoxy systems for semiconductor packaging
Powder coating resins requiring halogen-free flame retardancy

Key Features

Dual-functional reactive hydroxyl groups enable covalent bonding into epoxy network for permanent non-leaching FR
High Tg retention in cured epoxy systems meets high-reliability PCB requirements (Tg >170 °C achievable)
Low phosphorus loading (0.8–1.5% P) sufficient for UL94 V-0 and IEC 61249-2-21 halogen-free CCL
Solid form with high melting point allows dry blending with epoxy resin powder for prepreg production