Thermal Interface Materials
48 products
Thermal Interface Materials
Thermally conductive compounds and phase-change materials for electronics cooling
48 products
48 products
thermal interface materials
Acrylic Thermal Adhesive
CAS: 9003-01-4
Acrylic Thermal Adhesive provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Alumina Ceramic Substrate
CAS: 1344-28-1
Alumina Ceramic Substrate provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Aluminum Nitride Powder
CAS: 24304-00-5
Aluminum Nitride Powder provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Barium Titanate Thermal Filler
CAS: 12047-27-7
Barium Titanate Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Beryllium Oxide Ceramic Filler
CAS: 1304-56-9
Beryllium Oxide Ceramic Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Boron Nitride Filler
CAS: 10043-11-5
Boron Nitride Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Carbon Black Thermal Additive
CAS: 1333-86-4
Carbon Black Thermal Additive provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Carbon Fiber Thermal Composite
CAS: 7440-44-0
Carbon Fiber Thermal Composite provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Carbon Nanotube Thermal Composite
CAS: 308068-56-6
Carbon Nanotube Thermal Composite provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Ceramic Filled Thermal Epoxy
CAS: 25085-99-8
Ceramic Filled Thermal Epoxy provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Coated Alumina Thermal Filler
CAS: 1344-28-1
Coated Alumina Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Copper Filled Thermal Paste
CAS: 7440-50-8
Copper Filled Thermal Paste provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Diamond Thermal Powder
CAS: 7782-40-3
Diamond Thermal Powder provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Expandable Graphite Thermal
CAS: 7440-44-0
Expandable Graphite Thermal provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Graphene Thermal Filler
CAS: 7782-42-5
Graphene Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Hexagonal BN Platelet
CAS: 10043-11-5
Hexagonal BN Platelet provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Indium Thermal Pad
CAS: 7440-74-6
Indium Thermal Pad provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Low Bleed Thermal Grease
CAS: 63148-62-9
Low Bleed Thermal Grease provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Low Melt Alloy Thermal Interface
CAS: 7439-93-2
Low Melt Alloy Thermal Interface provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Magnesia Thermal Filler
CAS: 1309-48-4
Magnesia Thermal Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Metal Oxide Blend Filler
CAS: 1309-48-4
Metal Oxide Blend Filler provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Mica Thermal Insulation
CAS: 12001-26-2
Mica Thermal Insulation provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Molybdenum Disulfide Thermal
CAS: 1317-33-5
Molybdenum Disulfide Thermal provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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Nano Alumina Thermal
CAS: 1344-28-1
Nano Alumina Thermal provides efficient heat dissipation between electronic components and heat sinks. Essential for thermal management in power electronics, LED lighting, and computing applications.
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