Electronic / Semiconductor Additives
50 products
Electronic / Semiconductor Additives
High-purity functional chemicals and additives for semiconductor fabrication
50 products
50 products
electronic semiconductor additives
Acrylic Conformal Coating
CAS: 9003-01-4
Acrylic conformal coating is a transparent protective polymer coating applied to PCBs to shield electronic assemblies from moisture, dust, chemicals, and temperature extremes. Based on acrylic resin chemistry, it offers excellent clarity, easy reworkability with common solvents, and rapid air-dry or UV cure. It is the most widely used conformal coating type in consumer and industrial electronics.
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Anisotropic Conductive Film (ACF)
CAS: 25068-38-6
Anisotropic conductive film (ACF) is a thin adhesive film containing conductive particles that provides electrical connection only in the Z-axis (thickness direction) while remaining insulating in the X-Y plane. It is used to bond and electrically connect flex circuits, LCD driver ICs, and chip-on-glass assemblies to substrates without solder. The thermocompression bonding process aligns particles between facing contact pads.
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Anti-Static Coating for Electronics
CAS: 25322-68-3
Anti-static coating for electronics is a dissipative or conductive polymer coating applied to PCBs, packaging, and electronic housings to prevent electrostatic discharge (ESD) damage to sensitive components. It provides a controlled surface resistivity in the range of 10⁵–10¹¹ Ω/sq, safely dissipating static charges. Meets ANSI/ESD S20.20 and IEC 61340 standards for ESD-safe manufacturing environments.
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CMP Slurry for Metal
CAS: 1344-28-1
CMP slurry for metal is a chemically active abrasive suspension designed for polishing copper, tungsten, or other metal interconnect layers during semiconductor fabrication. It uses complexing agents and oxidizers in combination with abrasive particles to achieve controlled metal removal and planarization. Critical for damascene copper interconnect formation in advanced logic nodes and tungsten plug CMP in memory devices.
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CMP Slurry for Oxide
CAS: 7631-86-9
CMP (chemical mechanical planarization) slurry for oxide is a colloidal silica or ceria-based abrasive suspension used to planarize silicon dioxide and other dielectric films on semiconductor wafers. It combines mechanical abrasion with chemical dissolution to achieve global planarization required for multi-layer IC fabrication. Critical for STI, ILD, and PMD planarization in advanced logic and memory devices.
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Carbon Conductive Paste
CAS: 1333-86-4
Carbon conductive paste is a cost-effective, screen-printable formulation of carbon black or graphite particles dispersed in a polymer binder, used for printing resistive elements, shielding layers, and electrode contacts in electronic devices. It provides tunable sheet resistance across a wide range and is compatible with flexible and rigid substrates. Commonly used in membrane switches, biosensors, and printed heating elements.
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Copper Etching Chemical
CAS: 7758-98-7
Copper etching chemical is an acidic or alkaline solution used to selectively remove unwanted copper from PCB surfaces during the pattern formation process. Alkaline ammoniacal etchants are preferred for inner layers, while cupric chloride or ferric chloride systems are used in various production environments. Controlled etch rate and undercut characteristics are critical for achieving fine line and space resolution.
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Copper Plating Additive
CAS: 7758-98-7
Copper plating additive is a proprietary blend of brighteners, levelers, and suppressors used in acid copper electroplating baths to produce smooth, bright, void-free copper deposits for PCB via filling and surface plating. It ensures uniform copper distribution across the entire board, including high aspect ratio vias, and provides deposits with excellent ductility for thermal cycling reliability. Used in both pattern plating and panel plating processes.
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Defluxer Agent
CAS: 111-76-2
Defluxer agent is a specialized solvent or aqueous solution formulated to dissolve and remove flux residues from PCBs and electronic assemblies after soldering operations. It effectively targets rosin-based, water-soluble, and no-clean flux residues while being safe for sensitive components and substrates. Available in aerosol, liquid concentrate, and ready-to-use formats.
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Die Attach Adhesive
CAS: 25068-38-6
Die attach adhesive is a high-performance epoxy or silicone-based adhesive used to bond semiconductor dies to leadframes, substrates, or package bases during IC assembly. It provides strong mechanical bonding, thermal conductivity, and electrical isolation or conductivity depending on formulation. Critical for ensuring die stability and heat dissipation in packaged semiconductor devices.
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Dielectric Coating
CAS: 63148-62-9
Dielectric coating is an electrically insulating polymer or ceramic thin film applied to electronic substrates, PCBs, and semiconductor surfaces to provide electrical isolation, voltage withstand, and environmental protection. Formulations include polyimide, parylene, and silicone-based systems offering different combinations of dielectric constant, thermal stability, and mechanical flexibility. Used where conformal insulating coverage is required on complex geometries.
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EMI Shielding Coating
CAS: 7440-22-4
EMI shielding coating is a conductive paint or spray formulation containing silver, copper, or nickel particles designed to attenuate electromagnetic interference on PCBs, enclosures, and electronic housings. It provides effective shielding effectiveness typically exceeding 60 dB across a broad frequency range. Used extensively in telecommunications, medical devices, and automotive electronics to meet EMC regulatory requirements.
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ENIG Surface Finish (Electroless Nickel Immersion Gold)
CAS: 7440-02-0
ENIG (Electroless Nickel Immersion Gold) is a two-layer PCB surface finish consisting of a 3–6 µm electroless nickel layer topped with a thin 0.05–0.15 µm immersion gold layer. The nickel provides a flat, solderable surface and a diffusion barrier, while the gold protects the nickel from oxidation and ensures excellent solderability. ENIG is the most widely used surface finish for fine-pitch SMT and wire bonding applications.
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Electrically Conductive Adhesive
CAS: 7440-22-4
Electrically conductive adhesive (ECA) is a silver or carbon-filled polymer adhesive used as a solder alternative for bonding and electrically interconnecting electronic components. It provides reliable low-resistance electrical contact while curing at temperatures well below lead-free solder reflow, making it suitable for heat-sensitive components and flexible substrates. Available in isotropic and anisotropic grades.
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Electroless Nickel Additive
CAS: 13477-29-7
Electroless nickel additive is a stabilizer, brightener, and complexant package used in electroless nickel plating baths to maintain consistent deposition rate, phosphorus content, and deposit quality for PCB and semiconductor applications. It ensures uniform nickel deposition across complex topographies without an external current source. The phosphorus content is controlled by additive composition to achieve low (2–4%), mid (6–9%), or high (10–12%) phosphorus grades.
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Electronic Cleaning Solvent
CAS: 67-63-0
Electronic cleaning solvent is a precision-grade solvent blend formulated to remove contamination from sensitive electronic components, PCBs, and semiconductor substrates without leaving residues or causing damage. Formulations include IPA-based, HFE-based, and nPB-free alternatives that offer fast evaporation, low toxicity, and excellent compatibility with electronic materials. Used in maintenance, rework, and precision cleaning applications.
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Electronic Grade Silicone Gel
CAS: 63148-62-9
Electronic grade silicone gel is an ultra-soft, lightly cross-linked silicone encapsulant that provides gentle, stress-free protection for delicate semiconductor devices and sensitive electronic assemblies. Its gel-like consistency allows components to flex without delamination, while providing excellent dielectric properties and protection from moisture and contamination. Widely used in automotive power modules, IGBT modules, and sensor packaging.
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Epoxy Conformal Coating
CAS: 25068-38-6
Epoxy conformal coating provides the hardest and most chemically resistant protective film among standard conformal coating types, offering outstanding protection in aggressive chemical and abrasive environments. Its two-component system cures to a rigid, impermeable film with excellent adhesion to FR4, ceramics, and metal substrates. It is particularly suited for downhole oil and gas electronics and chemical processing instrumentation.
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Epoxy Potting Compound
CAS: 25068-38-6
Epoxy potting compound is a two-component encapsulant poured around electronic assemblies to provide mechanical protection, moisture exclusion, thermal management, and chemical resistance. Upon cure it forms a rigid, durable mass that permanently encases sensitive electronics from environmental and mechanical stresses. Widely used in transformers, sensors, connectors, and outdoor LED drivers.
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Gold Finger Protective Coating
CAS: 13453-07-1
Gold finger protective coating is a hard gold electroplating solution or post-treatment used to protect PCB edge connector contacts (gold fingers) from wear, oxidation, and contact resistance degradation over thousands of insertion cycles. The cobalt-hardened gold deposit meets IPC-4552 and MIL-G-45204 specifications for contact finishes. Applied over a nickel barrier layer to prevent copper diffusion into the gold.
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Gold Plating Additive
CAS: 13453-07-1
Gold plating additive is used in hard or soft gold electroplating baths to control grain structure, hardness, and deposit purity for PCB contact fingers, wire bond pads, and connector surfaces. Hard gold additives incorporate cobalt or nickel co-deposition for wear resistance, while soft gold additives produce high-purity deposits suitable for wire bonding. Used across semiconductor packaging, PCB surface finish, and high-reliability connector applications.
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HASL Surface Finish (Hot Air Solder Leveling)
CAS: 7440-31-5
HASL (Hot Air Solder Leveling) is a PCB surface finish process where bare copper pads are coated with molten solder and excess solder is removed by hot air knives, leaving a solderable tin-lead or lead-free solder coating. It is one of the oldest and most cost-effective PCB surface finishes, providing excellent solderability and long shelf life. Lead-free HASL uses SAC alloys to comply with RoHS requirements.
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Hafnium ALD Precursor
CAS: 69038-57-9
Hafnium ALD precursor is a volatile organometallic compound used in atomic layer deposition (ALD) to grow ultra-thin hafnium oxide (HfO₂) high-k dielectric films for advanced gate dielectrics and DRAM capacitors. Common precursors include TEMAH and HfCl₄, which react with water or ozone oxidants to deposit conformal, pinhole-free HfO₂ at low temperatures. Essential for sub-10 nm CMOS logic and high-density memory fabrication.
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Immersion Silver Additive
CAS: 7761-88-8
Immersion silver additive is a complexant and anti-tarnish package for immersion silver PCB surface finish baths, depositing a thin 0.1–0.4 µm silver layer on copper pads via displacement plating. The anti-tarnish organic inclusion in the deposit prevents silver sulfidation and maintains solderability during storage. Immersion silver provides excellent electrical performance for high-frequency applications and is compatible with all soldering methods.
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