Anisotropic Conductive Film (ACF)
CAS Number: 25068-38-6
Anisotropic conductive film (ACF) is a thin adhesive film containing conductive particles that provides electrical connection only in the Z-axis (thickness direction) while remaining insulating in the X-Y plane. It is used to bond and electrically connect flex circuits, LCD driver ICs, and chip-on-glass assemblies to substrates without solder. The thermocompression bonding process aligns particles between facing contact pads.
Technical Specifications
| appearance | Thin film on release liner, red or gold tint |
| bondCondition | 170–190°C, 2–5 MPa, 5–20 s |
| filmThickness | 15–35 µm |
| contactResistance | <50 mΩ per bump |
| conductiveParticle | Au-coated polymer or Ni/Au, 3–10 µm |
| insulationResistance | >10⁸ Ω between adjacent pads |
Applications
- LCD and OLED display driver IC bonding
- Chip-on-glass (COG) and chip-on-flex (COF) assembly
- Flex-to-PCB interconnection
- Camera module flex bonding
- Wearable device display bonding
Key Features
- Z-axis only conductivity enables ultra-fine pitch connections
- No flux or cleaning required — clean process
- Flexible adhesive film conforms to uneven surfaces
- Compatible with glass, polyimide, and FR4 substrates