Thermal Interface Material
CAS Number: 1344-28-1
Thermal interface material (TIM) is a thermally conductive compound or paste applied between heat-generating electronic components and heatsinks to minimize thermal contact resistance. Filled with alumina, zinc oxide, or boron nitride particles, TIMs fill microscopic air gaps and surface irregularities that otherwise impede heat flow. Critical for CPUs, GPUs, power semiconductors, and LED modules where thermal management is paramount.
Technical Specifications
| viscosity | 100,000–500,000 cP (paste grade) |
| appearance | White or gray paste/pad |
| thermalResistance | <0.1 °C·cm²/W at 50 psi |
| dielectricStrength | >10 kV/mm |
| thermalConductivity | 1.5–12 W/m·K |
| operatingTemperature | -50°C to +200°C |
Applications
- CPU and GPU heatsink interface
- Power semiconductor module thermal management
- LED COB module heat spreading
- Battery pack thermal management
- Server rack electronics cooling
Key Features
- Eliminates air gap thermal resistance at interfaces
- Non-curing, reworkable paste or phase-change grades
- Electrically insulating for direct component contact
- Stable thermal performance over thousands of cycles