Thermally Conductive Adhesive
CAS Number: 25068-38-6
Thermally conductive adhesive is an epoxy or silicone-based formulation filled with thermally conductive fillers such as alumina, boron nitride, or silver to facilitate heat transfer from electronic components to heatsinks or substrates. It combines structural bonding with efficient thermal management, eliminating the need for separate mechanical fasteners. Widely used in power electronics, LED assemblies, and computing hardware.
Technical Specifications
| viscosity | 30,000–200,000 cP |
| appearance | White or gray paste |
| bondStrength | >5 MPa (lap shear) |
| cureCondition | 80–150°C / 30–60 min or RTV |
| thermalConductivity | 1.5–8 W/m·K |
| operatingTemperature | -55°C to +200°C |
Applications
- Heatsink bonding to power semiconductors
- LED module thermal management
- CPU/GPU heat spreader attachment
- Power converter component bonding
- Substrate-to-chassis thermal bonding
Key Features
- High thermal conductivity for effective heat dissipation
- Eliminates need for mechanical heatsink fasteners
- Electrically insulating grades available
- Flexible after cure to accommodate CTE mismatch