Trimethylsilyl Diethylamine (TMSDEA) Silylation Agent
CAS Number: 996-50-9
Trimethylsilyl diethylamine (TMSDEA) is a silylation reagent used in semiconductor lithography to modify photoresist surface chemistry and enhance adhesion. As a surface treatment agent for silylated resist processes (e.g., DESIRE process), it converts OH groups on resist surfaces to OSi(CH3)3 groups, improving etch selectivity. Also used in ALD surface functionalization and low-k dielectric surface repair.
Technical Specifications
| appearance | Colorless clear liquid |
| purity (%) | ≥99.5 (GC assay) |
| boiling point | 126°C |
| water content | ≤50 ppm |
| metallic impurities | ≤1 ppb each |
Applications
- Silylated photoresist surface modification (DESIRE process)
- ALD surface hydroxyl group functionalization
- Low-k dielectric surface repair after plasma damage
- Photoresist adhesion promotion on oxide surfaces
- Surface passivation for selective area deposition
Key Features
- High reactivity with surface OH groups for rapid silylation at room temperature
- Metal-ion-free formulation suitable for CMOS gate dielectric processes
- Byproduct (diethylamine) is volatile and easily removed by purge
- Moisture-sensitive; supplied under inert gas in sealed metal containers
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CAS Number
996-50-9
Category
Semiconductor Etching ChemicalsAvailability
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