Hexamethyldisilazane (HMDS) Adhesion Promoter
CAS Number: 999-97-3
Hexamethyldisilazane (HMDS) is the universal photoresist adhesion promoter used in semiconductor lithography. Applied by vapor prime or spin-coat before photoresist coating, HMDS reacts with surface OH groups to form a hydrophobic trimethylsilyl (TMS) monolayer, dramatically improving photoresist adhesion on oxide and nitride surfaces and preventing pattern delamination during development.
Technical Specifications
| appearance | Colorless clear liquid |
| purity (%) | ≥99.9 (GC assay) |
| boiling point | 125°C |
| water content | ≤20 ppm |
| metallic impurities | ≤0.1 ppb each |
Applications
- Vapor prime before photoresist spin-coat (HMDS oven)
- Oxide and nitride surface hydrophobization
- Photoresist adhesion on via and contact hole sidewalls
- Wafer surface prep for dry-developed resists
- Silicon wafer surface passivation after HF clean
Key Features
- Industry-standard adhesion promoter validated across all major resist platforms
- Vapor prime enables uniform treatment of complex 3D wafer topographies
- Ultra-low water content prevents premature hydrolysis during storage
- Compatible with g-line, i-line, DUV 248nm, and 193nm resist systems
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CAS Number
999-97-3
Category
Semiconductor Etching ChemicalsAvailability
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