Copper Sulfate Damascene Electroplating (CuSO4)
CAS Number: 7758-98-7
Semiconductor grade copper sulfate pentahydrate (CuSO4·5H2O) is the primary copper ion source in acidic electroplating baths for damascene and dual-damascene copper interconnect fabrication. Used in combination with sulfuric acid, chloride ions, and organic additives (accelerator, suppressor, leveler), it enables the superfilling (bottom-up fill) of high-aspect-ratio vias and trenches in advanced BEOL processes.
Technical Specifications
| appearance | Blue crystalline powder or solution |
| purity (%) | ≥99.9 (CuSO4·5H2O assay) |
| chloride (Cl-) | ≤5 ppm |
| solution concentration | 40–80 g/L Cu²⁺ (in-bath) |
| metallic impurities (Fe, Ni, Pb) | ≤1 ppm each |
Applications
- Damascene copper interconnect electroplating (BEOL)
- Through-silicon via (TSV) copper fill
- Wafer-level packaging (WLP) copper pillar plating
- PCB and advanced packaging redistribution layer (RDL)
- Bumping and flip-chip interconnect plating
Key Features
- High purity ensures void-free bottom-up superfill in sub-10nm vias
- Compatible with leading organic additive systems for Cu superfill
- Available as anhydrous powder or ready-to-use concentrated solution
- Low iron and lead content prevents electromigration reliability issues
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CAS Number
7758-98-7
Category
Semiconductor Etching ChemicalsAvailability
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