Gold Cyanide Electroplating Solution (KAu(CN)2)
CAS Number: 13967-50-5
Potassium gold cyanide (KAu(CN)2) is the primary gold salt used in semiconductor gold electroplating baths for wire bonding pad plating, connector contact finishing, and optoelectronic device metallization. Its stable cyanide complex provides smooth, bright gold deposits with excellent wire bondability and corrosion resistance. Used in both acid and neutral pH bath formulations.
Technical Specifications
| Au content | ≥68.3 wt% (as KAu(CN)2) |
| appearance | Pale yellow clear solution |
| purity (%) | ≥99.9 (KAu(CN)2 assay) |
| cyanide stability | Stable at pH 6–9 |
| metallic impurities (Ag, Cu, Fe) | ≤5 ppm each |
Applications
- Wire bonding pad gold plating (Au bump)
- Semiconductor lead frame and connector plating
- Optoelectronic device contact metallization
- MEMS gold electroforming structures
- High-frequency RF device gold contact plating
Key Features
- High-purity gold deposits with excellent wire bondability (MIL-G-45204 compliant)
- Stable bath chemistry with low decomposition rate
- Compatible with both soft gold (99.9%) and hard gold (Co/Ni alloyed) formulations
- Low porosity deposits provide superior corrosion protection
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CAS Number
13967-50-5
Category
Semiconductor Etching ChemicalsAvailability
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