Electroless Nickel Sodium Hypophosphite (NaH2PO2)
CAS Number: 7681-53-0
Sodium hypophosphite monohydrate (NaH2PO2·H2O) is the reducing agent in electroless nickel (EN) plating baths, enabling autocatalytic deposition of nickel-phosphorus alloy without external current. In semiconductor packaging, ENIG (Electroless Nickel Immersion Gold) and ENEPIG surface finishes rely on sodium hypophosphite-based EN baths to provide solderable, wire-bondable, and corrosion-resistant surfaces on PCBs and substrates.
Technical Specifications
| iron (Fe) | ≤10 ppm |
| appearance | White crystalline powder |
| purity (%) | ≥99.0 (NaH2PO2 assay) |
| chloride (Cl-) | ≤50 ppm |
| heavy metals (Pb, As) | ≤5 ppm each |
Applications
- ENIG (Electroless Nickel Immersion Gold) surface finish
- ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
- Under-bump metallization (UBM) barrier layer
- Semiconductor substrate solderable surface preparation
- MEMS selective metal deposition
Key Features
- High reducing power for stable autocatalytic EN plating bath
- Controlled P content in deposit (5–12%) via concentration management
- Low chloride content minimizes corrosion risk in EN bath
- Consistent solubility for easy bath makeup and replenishment
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CAS Number
7681-53-0
Category
Semiconductor Etching ChemicalsAvailability
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