Palladium Chloride Plating Activation (PdCl2)
CAS Number: 13138-48-2
Palladium chloride (PdCl2) solution is used as an activation catalyst for electroless plating on non-conductive substrates and for sensitizing surfaces prior to electroless nickel or copper deposition. In semiconductor packaging, it enables selective metal deposition on dielectric surfaces for PCB vias, wafer-level packaging, and advanced substrate manufacturing.
Technical Specifications
| Pd content | ≥59.5 wt% (as PdCl2) |
| appearance | Brown to dark red solution |
| purity (%) | ≥99.9 (PdCl2 assay) |
| HCl content | 5–10% (for stability) |
| metallic impurities (Pt, Rh, Fe) | ≤10 ppm each |
Applications
- Electroless nickel/copper activation on dielectrics
- PCB through-hole and via metallization
- Wafer-level packaging substrate activation
- Pd catalyst for fuel cell MEA fabrication
- Selective area electroless plating on polymers
Key Features
- Highly active Pd catalyst for uniform electroless plating nucleation
- HCl-stabilized solution prevents Pd precipitation and extends bath life
- Compatible with tin-palladium (Sn/Pd) two-step activation process
- Low precious metal loading reduces cost per wafer/panel processed
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CAS Number
13138-48-2
Category
Semiconductor Etching ChemicalsAvailability
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