Edge Bead Remover (EBR) Solvent for Wafer Edge
Edge bead remover (EBR) is a precisely formulated solvent blend used to dissolve and remove the photoresist bead that accumulates at the wafer edge during spin-coating. The EBR is dispensed on the front edge (EBR front) or back edge (EBR back) of the rotating wafer immediately after resist coat, preventing edge bead contamination of wafer handling equipment and chucks during subsequent lithography steps.
Technical Specifications
| appearance | Colorless clear liquid |
| purity (%) | ≥99.9 (solvent blend assay) |
| water content | ≤100 ppm |
| metallic impurities | ≤1 ppb each |
| non-volatile residue | ≤0.5 ppm |
Applications
- Photoresist edge bead removal after spin-coat
- Back-side resist clean on wafer chucks
- Wafer backside clean for chuck contamination prevention
- Thin film edge exclusion zone creation
- Spin-on dielectric (SOD/SOG) edge clean
Key Features
- Optimized solvent blend for clean, sharp edge exclusion without splattering
- Compatible with all common novolac, CAR, and EUV photoresist formulations
- Fast evaporation prevents EBR liquid from migrating under the resist film
- Ultra-low non-volatile residue prevents edge defect formation
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