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Nitric Acid Semiconductor Grade (HNO3 69%)

CAS Number: 7697-37-2

Semiconductor grade nitric acid (69%) is used in silicon etching chemistry, metal surface oxidation, and wafer cleaning processes. In combination with HF, it forms the standard silicon etch mixture (HNA: HF/HNO3/HAc) for isotropic silicon etching. Its ultra-pure formulation meets SEMI C1 standards with trace metal content below 1 ppb.

Technical Specifications

appearanceColorless to faint yellow clear liquid
purity (%)≥69.0 (HNO3 assay)
sulfate (SO4)≤0.1 ppm
chloride (Cl-)≤0.1 ppm
metallic impurities≤1 ppb each (SEMI C1 grade)

Applications

  • HNA (HF/HNO3/acetic acid) isotropic silicon etching
  • Metal surface oxidation and passivation
  • Piranha (SPM) solution component
  • Aluminum and titanium metal etching
  • Wafer surface organic contamination removal

Key Features

  • SEMI C1 ultra-pure grade suitable for critical FEOL wet processes
  • Strong oxidizing capability for effective silicon surface passivation
  • Low color and low NOx content for clean-room compatibility
  • Available in stabilized formulation to minimize decomposition

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Nitric Acid Semiconductor Grade (HNO3 69%) chemical structure

CAS Number

7697-37-2

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