Sulfuric Acid Semiconductor Grade (H2SO4 96%)
CAS Number: 7664-93-9
Semiconductor grade sulfuric acid (96%) is a primary chemical used in SPM (sulfuric acid/hydrogen peroxide mixture, piranha) cleaning to remove organic photoresist and contaminants from wafer surfaces. Its ultra-high purity ensures no introduction of metallic impurities during critical cleaning steps. Also used in electroplating baths for copper damascene processes.
Technical Specifications
| appearance | Colorless oily liquid |
| purity (%) | ≥96.0 (H2SO4 assay) |
| chloride (Cl-) | ≤0.1 ppm |
| metallic impurities | ≤1 ppb each (SEMI C2 grade) |
| nitrogen compounds (as N) | ≤0.5 ppm |
Applications
- SPM (piranha) photoresist strip and clean
- Pre-diffusion wafer cleaning
- Copper electroplating bath electrolyte
- Organic contamination removal from silicon wafers
- Ion implant photoresist removal
Key Features
- SEMI C2 grade with ultra-low metallic and particle contamination
- Highly effective SPM photoresist strip when combined with H2O2
- Stable density and assay ensuring reproducible process results
- Supplied in FEP-lined containers to prevent trace metal leaching
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CAS Number
7664-93-9
Category
Semiconductor Etching ChemicalsAvailability
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