SU-8 Epoxy Negative Photoresist
SU-8 is a chemically amplified, epoxy-based negative-tone photoresist capable of producing very thick (1–500 µm), high-aspect-ratio (>20:1) microstructures with near-vertical sidewalls. Widely adopted for MEMS fabrication, microfluidics, and advanced packaging, SU-8 crosslinks upon UV or near-UV exposure to form a chemically and mechanically robust permanent or sacrificial structure suitable for demanding applications.
Technical Specifications
| appearance | Dark amber viscous liquid |
| purity (%) | ≥99.5 (solids content by formulation) |
| viscosity (cP) | 45–55000 (multiple thickness grades) |
| aspect ratio achievable | >20:1 |
| available film thickness | 1–500 µm per coat |
Applications
- MEMS microstructure and cantilever fabrication
- Microfluidic channel and lab-on-chip molds
- Electroplating mold for LIGA process
- Wafer-level packaging structural layer
- Optical waveguide and micro-optics fabrication
Key Features
- Unique capability for ultra-thick (>100 µm) high-aspect-ratio microstructures
- Chemically amplified formulation for high sensitivity with near-UV (365nm) exposure
- Excellent chemical resistance after hard bake for use in harsh environments
- Can be used as permanent structural material or sacrificial mold layer
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