Nickel Sulfamate Electroplating Solution
CAS Number: 13770-89-3
Nickel sulfamate (Ni(SO3NH2)2) is the preferred nickel salt for electroplating applications requiring low internal stress, high deposit hardness, and excellent ductility. In semiconductor packaging, it is used for MEMS electroforming, under-bump metallization (UBM), and magnetic actuator fabrication. Its low-stress deposits are critical for high-aspect-ratio LIGA microstructures.
Technical Specifications
| Ni content | ≥100 g/L (as Ni²⁺) |
| appearance | Green clear solution |
| pH (25°C) | 3.5–4.5 |
| purity (%) | ≥99.5 (Ni(SO3NH2)2 assay) |
| metallic impurities (Fe, Cu, Pb) | ≤5 ppm each |
Applications
- MEMS electroforming and high-aspect-ratio structures
- Under-bump metallization (UBM) in flip-chip packaging
- Magnetic MEMS actuator and sensor fabrication
- Electroformed nozzle and precision tooling
- Semiconductor lead frame plating
Key Features
- Low internal stress deposits minimizing warpage in thin film structures
- High current efficiency enabling fast deposition rates
- Low sulfur content compared to Watts bath for improved ductility
- Compatible with LIGA and UV-LIGA photoresist mold processes
Send Inquiry
CAS Number
13770-89-3
Category
Semiconductor Etching ChemicalsAvailability
In StockSample
Dispatched within 5 days
More in Semiconductor Etching Chemicals
Acetone Semiconductor Grade (Photoresist Removal)
67-64-1
Aluminum Chloride ALD Precursor (AlCl3)
7446-70-0
Ammonia Semiconductor Grade (NH3 Nitride CVD)
7664-41-7
Ammonium Fluoride Semiconductor Grade (NH4F 40%)
12125-01-8
Ammonium Hydroxide Semiconductor Grade (NH4OH SC-1)
1336-21-6
Argon Sputtering Gas (Ar Ultra-Pure)
7440-37-1
Bottom Anti-Reflective Coating (BARC)
Buffered Oxide Etch (BOE) NH4F/HF
7664-39-3