CMP Pad Conditioner Diamond Dresser
CMP pad conditioners use electroplated or brazed diamond abrasives on a stainless steel disk to continuously dress and re-texture CMP polishing pads during wafer planarization. Regular conditioning removes glazed pad surfaces and restores the micro-asperity structure necessary for consistent slurry transport and removal rate. Essential for maintaining pad-to-pad and wafer-to-wafer removal rate uniformity.
Technical Specifications
| appearance | Circular metal disk with diamond grit surface |
| purity (%) | ≥99.9 (diamond abrasive grade) |
| disk diameter | 100–200 mm (tool-dependent) |
| diamond bond type | Electroplated or brazed |
| diamond grit size | 40–200 µm (application-dependent) |
Applications
- In-situ CMP pad conditioning during oxide and metal polish
- Ex-situ pad break-in and re-texturing
- STI, Cu damascene, and W plug CMP processes
- Pad lifetime extension and removal rate recovery
- 200mm and 300mm CMP tool compatibility
Key Features
- Consistent pad surface topography recovery for stable removal rates
- Brazed diamond option provides longer service life than electroplated
- Custom grit size and pattern available for specific CMP process needs
- Compatible with Mirra, Reflexion, and FREX-series CMP platforms
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