Electronic / Semiconductor Additives
50 products
Electronic / Semiconductor Additives
High-purity functional chemicals and additives for semiconductor fabrication
50 products
50 products
electronic semiconductor additives
Immersion Tin Additive
CAS: 7772-99-8
Immersion tin additive is a stabilizer and complexant system for immersion tin PCB surface finish baths, producing a thin, flat, solderable tin deposit on copper pads via displacement reaction. It prevents whisker growth and tin-copper intermetallic formation through thiourea-based or alternative complexant chemistries. Immersion tin provides excellent fine-pitch solderability and is a lead-free, RoHS-compliant surface finish.
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LED Encapsulant
CAS: 63148-62-9
LED encapsulant is an optically transparent silicone or epoxy resin used to protect LED chips and phosphors while maximizing light extraction efficiency. It must maintain optical clarity and yellowing resistance under prolonged UV and thermal exposure, with a refractive index matched to semiconductor chips. Available in soft and hard grades for various LED package formats including SMD, COB, and high-power modules.
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Low-k Dielectric Additive
CAS: 17689-77-9
Low-k dielectric additive is a pore-generating or matrix-modifying chemical incorporated into dielectric thin films to reduce the dielectric constant (k) below 3.0 for advanced semiconductor interconnect layers. Reducing k lowers RC delay and cross-talk in dense IC metallization. Porogen-based additives introduce controlled nanopores into CVD or spin-on dielectric matrices to achieve ultra-low-k (ULK) values.
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Nickel Plating Additive
CAS: 7786-81-4
Nickel plating additive is a formulated blend of organic brighteners and stress reducers for Watts or sulfamate nickel electroplating baths, producing semi-bright to fully bright, low-stress nickel deposits for electronic components and PCB surface finishes. It provides a diffusion barrier layer in gold plating sequences and serves as a corrosion-resistant undercoat. Used in connector plating, PCB edge connectors, and lead-frame finishing.
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No-Clean Flux
CAS: 8050-09-7
No-clean flux is a low-residue soldering flux formulated to leave minimal, electrically safe residues that do not require post-solder cleaning. It promotes excellent solder wetting on copper, tin, and other metallic surfaces while maintaining high insulation resistance. Widely used in surface mount technology (SMT) and through-hole assembly processes.
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PCB Anti-Tarnish Agent
CAS: 95-14-7
PCB anti-tarnish agent is a thin organic surface treatment applied to bare copper and metal surfaces on PCBs to prevent oxidation and tarnishing during storage and handling before assembly. Based on benzotriazole or imidazole chemistry, it forms a monomolecular protective layer that is soldering-compatible and does not impair wettability. Critical for maintaining solderability during long storage periods.
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PCB Cleaner
CAS: 67-63-0
PCB cleaner is a precision electronic cleaning agent designed to remove flux residues, ionic contaminants, and particulate matter from printed circuit boards after soldering. Formulated as low-toxicity, fast-evaporating solvent blends or aqueous systems, these cleaners leave no residue and are safe for sensitive electronic components. They meet IPC cleanliness standards and support both batch and inline cleaning processes.
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PCB Legend Ink
CAS: 25036-25-3
PCB legend ink is a screen-printable or inkjet-printable epoxy or acrylic ink used to print component reference designators, polarity marks, and logos on PCB surfaces. It must adhere strongly to solder mask, resist soldering temperatures, and remain legible after assembly processes. Available in white, yellow, and black formulations for both conventional and UV-cure printing methods.
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Photoresist Stripper
CAS: 872-50-4
Photoresist stripper is a solvent or alkaline aqueous solution used to remove photoresist films from semiconductor wafers, PCBs, and flat panel display substrates after patterning and etching steps. It must completely dissolve or lift off both exposed and unexposed resist without damaging underlying metal layers or dielectrics. Available in NMP-based, solvent-blend, and aqueous alkaline formulations for various resist types.
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Polyurethane Conformal Coating
CAS: 9009-54-5
Polyurethane conformal coating delivers superior chemical resistance and abrasion resistance compared to acrylic alternatives, making it ideal for harsh industrial and automotive environments. It forms a tough, flexible film with excellent moisture and solvent barrier properties. Both solvent-borne and water-borne formulations are available to meet varying VOC and application requirements.
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Semiconductor Encapsulant
CAS: 25068-38-6
Semiconductor encapsulant is an epoxy molding compound or liquid encapsulant used to protect semiconductor dies and wire bonds from mechanical damage, moisture, and contamination in final package assembly. It provides excellent adhesion to die surfaces, leadframes, and substrates while maintaining low ionic impurity levels critical for long-term device reliability. Used in QFP, DIP, SOP, and advanced IC packages.
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Silicon CVD Precursor
CAS: 992-94-9
Silicon CVD precursor is a volatile silicon-containing compound such as silane (SiH₄), TEOS, or DCS used in chemical vapor deposition to grow silicon, silicon dioxide, silicon nitride, and polysilicon films on semiconductor wafers. These films serve as gate electrodes, dielectrics, passivation layers, and structural elements in MEMS. High purity is mandatory to avoid device performance degradation from trace metallic contaminants.
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Silicone Conformal Coating
CAS: 63148-62-9
Silicone conformal coating provides outstanding protection for PCBs operating in extreme temperature environments, offering a wide service range from -65°C to +200°C. Its flexible, rubber-like film resists thermal cycling fatigue and provides excellent dielectric properties even at high humidity. Preferred for aerospace, automotive under-hood, and high-temperature industrial applications.
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Silicone Potting Compound
CAS: 63148-62-9
Silicone potting compound is a flexible, thermally stable encapsulant used for embedding sensitive electronic assemblies that require protection from moisture, vibration, and thermal cycling without imposing rigid mechanical constraints. Its low modulus and excellent thermal stability from -60°C to +200°C make it ideal for automotive, aerospace, and high-power electronics. Both addition-cure and condensation-cure grades are available.
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Silicone Thermal Pad
CAS: 63148-62-9
Silicone thermal pad is a pre-formed, thermally conductive sheet material used as a solid-form thermal interface between electronic components and heatsinks. Unlike paste-form TIMs, thermal pads are clean, easy to handle, and provide consistent bond line thickness for high-volume manufacturing. They combine the softness of silicone with ceramic or metallic thermal filler particles for effective heat dissipation.
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Silver Conductive Paste
CAS: 7440-22-4
Silver conductive paste is a screen-printable or dispensable formulation of fine silver particles in a polymer binder, providing high electrical conductivity for printed electronics, solar cells, and hybrid circuit applications. Upon curing or sintering, the silver particles form a low-resistance conductive network. It is the industry standard for front-side metallization of silicon solar cells and thick-film circuit fabrication.
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Solder Mask Ink
CAS: 25036-25-3
Solder mask ink is a photoimageable or thermally cured polymer coating applied to PCB surfaces to protect copper traces from oxidation and prevent solder bridging during assembly. It defines the solderable pad openings with high precision and provides long-term electrical insulation and chemical resistance. Available in liquid photoimageable (LPI) and dry film formats with green, red, blue, and black color options.
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Solder Paste Flux
CAS: 8050-09-7
Solder paste flux is a specially formulated rosin or synthetic resin flux vehicle used as the carrier medium in solder paste for SMT applications. It provides oxide removal, thermal stability during reflow, and controlled rheology for stencil printing. The flux system ensures reliable solder joint formation and is available in no-clean and water-washable grades.
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Spin-On Glass (SOG)
CAS: 7631-86-9
Spin-on glass (SOG) is a silica-based solution deposited by spin coating on semiconductor wafers and cured to form a planarizing silicon oxide film for gap-fill and interlayer dielectric (ILD) applications. It provides excellent gap-fill capability for sub-micron features without the need for high-vacuum deposition equipment. Available in silicate, siloxane, and hydrogen silsesquioxane (HSQ) chemistries.
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TMAH Photoresist Developer
CAS: 75-59-2
TMAH (tetramethylammonium hydroxide) photoresist developer is the industry-standard aqueous alkaline developer for positive-tone photoresists in semiconductor and flat panel display manufacturing. It precisely develops exposed resist regions without leaving metallic ion contamination, making it compatible with CMOS processes. Supplied as 2.38% standard concentration for most photoresist systems, with alternative concentrations for specialized processes.
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Thermal Interface Material
CAS: 1344-28-1
Thermal interface material (TIM) is a thermally conductive compound or paste applied between heat-generating electronic components and heatsinks to minimize thermal contact resistance. Filled with alumina, zinc oxide, or boron nitride particles, TIMs fill microscopic air gaps and surface irregularities that otherwise impede heat flow. Critical for CPUs, GPUs, power semiconductors, and LED modules where thermal management is paramount.
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Thermally Conductive Adhesive
CAS: 25068-38-6
Thermally conductive adhesive is an epoxy or silicone-based formulation filled with thermally conductive fillers such as alumina, boron nitride, or silver to facilitate heat transfer from electronic components to heatsinks or substrates. It combines structural bonding with efficient thermal management, eliminating the need for separate mechanical fasteners. Widely used in power electronics, LED assemblies, and computing hardware.
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UV Curing Ink for Electronics
CAS: 7473-98-5
UV curing ink for electronics is a radiation-curable formulation used in inkjet or screen printing of functional layers on PCBs, flexible circuits, and electronic substrates. It cures instantly under UV or LED-UV irradiation, enabling high-throughput production of solder masks, dielectric layers, and decorative markings. Designed for excellent adhesion to copper and laminate surfaces with high chemical resistance after cure.
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Underfill Epoxy
CAS: 25068-38-6
Underfill epoxy is a capillary or no-flow epoxy encapsulant dispensed beneath flip-chip, BGA, and CSP packages to redistribute thermal and mechanical stress across solder joints, dramatically improving fatigue life. It fills the gap between the chip and the substrate by capillary action and cures to a rigid, hermetically sealed structure. Critical for high-reliability mobile, server, and automotive applications.
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